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Accurate Indoor Positioning Using Temporal-Spatial Constraints Based on Wi-Fi Fine Time Measurements 期刊论文
IEEE INTERNET OF THINGS JOURNAL, 2020, 卷号: 7, 期号: 11, 页码: 11006-11019
作者:  Shao, Wenhua;  Luo, Haiyong;  Zhao, Fang;  Tian, Hui;  Yan, Shuo
收藏  |  浏览/下载：26/0  |  提交时间：2021/12/01
Visual Defect Inspection for Deep-Aperture Components With Coarse-to-Fine Contour Extraction 期刊论文
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2020, 卷号: 69, 期号: 6, 页码: 3262-3274
作者:  Gong, Xinyi;  Su, Hu;  Xu, De;  Zhang, Jiabin;  Zhang, Lei
收藏  |  浏览/下载：16/0  |  提交时间：2020/08/03
A Robust Dead Reckoning Algorithm Based on Wi-Fi FTM and Multiple Sensors 期刊论文
REMOTE SENSING, 2019, 卷号: 11, 期号: 5
作者:  Yu, Yue;  Chen, Ruizhi;  Chen, Liang;  Guo, Guangyi;  Ye, Feng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/05
Analytic coarse alignment and calibration for inertial navigation system on swaying base assisted by star sensor 期刊论文
IET SCIENCE MEASUREMENT & TECHNOLOGY, 2018, 卷号: 12, 页码: 673-677
作者:  Lu, Jiazhen;  Liang, Shufang;  Yang, Lie
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
Micro-vision servo control of a multi-axis alignment system for optical fiber assembly 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2017, 卷号: 27
作者:  Chen, Weihai;  Yu, Fei;  Qu, Jianliang;  Chen, Wenjie;  Zhang, Jianbin
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30
A design of electric hydraulic lifting device supported by mechanical structure 期刊论文
Key Engineering Materials, 2014, 卷号: 621, 期号: [db:dc_citation_issue], 页码: 317-322
作者:  Ren, Xiaoli;  Shang, Xuemei;  Fan, Chen;  Du, Yanting
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
GPSOne精定位的最优MAR值迭代算法 期刊论文
2013
李玉; 吴榕华; 许芳
收藏  |  浏览/下载：13/0  |  提交时间：2016/05/17
Modeling and analyzing for ultra-precision coarse-fine stage 期刊论文
2010, 2010
Yang Yibo; Yin Wensheng; Zhu Yu; Wang Chunhong
收藏  |  浏览/下载：4/0
靶点位置可调的270°偏转磁铁系统的模拟计算 期刊论文
2010, 2010
李泉凤; 王光强; 邢庆子; 陈怀璧; LI Quanfeng; WANG Guangqiang; XING Qingzi; CHEN Huaibi
收藏  |  浏览/下载：3/0
Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE) 会议论文
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
Cui J.; Zhao J.; Fan Z.; Zhao C.; Bi Y.; Zhang J.; Niu G.; Shi Z.; Pei B.; Zhang G.; Xue Y.; Qi Y.
收藏  |  浏览/下载：14/0  |  提交时间：2013/03/25
The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting  when the cutting velocity equals 100mm/min  while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth  double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow  rapid cutting speed  the cutting quality meets the expecting demand.  fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power  using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence  a /4 waveplate to compensate heat -induced birefraction  utilize the Nd:YAG self- aperture effect  more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens  double axis linear step motor positioning system  suitable beam expander multiplying factor  appropriate diameter of exit beam aperture  proper repetition rate  when the cutting velocity equals 400mm/min  0.75mm thick silicon wafer can be penetrated  

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