CORC

浏览/检索结果: 共2条,第1-2条 帮助

已选(0)清除 条数/页:   排序方式:
Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD 期刊论文
IEEE Transactions on Circuits and Systems I: Regular Papers, 2019, 卷号: 66, 页码: 226-238
作者:  Zhao, Xiaoqing;  Sun, Hongbin;  Liu, Longjun;  Yang, Yang;  Dai, Liangliang
收藏  |  浏览/下载:17/0  |  提交时间:2019/11/19
Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD 期刊论文
IEEE Transactions on Circuits and Systems I: Regular Papers, 2019, 卷号: Vol.66 No.1, 页码: 226-238
作者:  Zhao, Xiaoqing;  Sun, Hongbin;  Liu, Longjun;  Yang, Yang;  Dai, Liangliang
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/17


©版权所有 ©2017 CSpace - Powered by CSpace