QQ客服 官方微博 反馈留言

	Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD
	Zhao, Xiaoqing; Sun, Hongbin; Liu, Longjun; Yang, Yang; Dai, Liangliang; Wu, Xiulong; Zhang, Ruizhi; Wang, Jianxiao; Zheng, Nanning
刊名	IEEE Transactions on Circuits and Systems I: Regular Papers
	2019
卷号	Vol.66 No.1页码:226-238
关键词	Address mappings Efficiency improvement Efficient architecture Non-volatile memory Prototypes Quantitative evaluation Random bit errors Solid state drives
ISSN号	1549-8328
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4743599
专题	湖南大学
推荐引用方式 GB/T 7714	Zhao, Xiaoqing,Sun, Hongbin,Liu, Longjun,et al. Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD[J]. IEEE Transactions on Circuits and Systems I: Regular Papers,2019,Vol.66 No.1:226-238.
APA	Zhao, Xiaoqing.,Sun, Hongbin.,Liu, Longjun.,Yang, Yang.,Dai, Liangliang.,...&Zheng, Nanning.(2019).Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD.IEEE Transactions on Circuits and Systems I: Regular Papers,Vol.66 No.1,226-238.
MLA	Zhao, Xiaoqing,et al."Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD".IEEE Transactions on Circuits and Systems I: Regular Papers Vol.66 No.1(2019):226-238.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。