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浏览/检索结果: 共8条，第1-8条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Electronic transport of organic-inorganic hybrid perovskites from first-principles and machine learning 期刊论文 APPLIED PHYSICS LETTERS, 2019, 卷号: 114 作者:  Li, Limeng[1];  You, Yang[2];  Hu, Shunbo[3];  Shi, Yada[4];  Zhao, Guodong[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/22 Prediction of weld formation in 5083 aluminum alloy by twin-wire CMT welding based on deep learning 期刊论文 2019, 卷号: 63, 页码: 947-955 作者:  Yin, Limeng;  Wang, Jinzhao;  Hu, Huiqin;  Han, Shanguo;  Zhang, Yupeng 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/20 Twin-wire CMT welding  5083 aluminum alloy  Deep learning  Neural network  Formation prediction   Electromigration induced growth behaviors of tin whisker on tin coating 期刊论文 2017, 卷号: 38, 页码: 35-38 作者:  Yao, Zongxiang[1,2];  Luo, Jian[1];  Yin, Limeng[2,3];  Jiang, Deping[2];  Wang, Gang[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/11/29 Effect of external loading on the growth behavior of tin whisker on tin coating 期刊论文 2016, 卷号: 37, 页码: 27-30 作者:  Yao, Zongxiang[1,2];  Luo, Jian[1];  Yin, Limeng[2,3];  Wang, Gang[2];  Zhang, Liping[2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/11/29 Comparison of wettability for Sn-based solders on copper and aluminum substrates (EI收录) 会议论文 Materials Science Forum, Qingdao, China, September 25, 2010 - September 28, 2010 作者:  Yin, Limeng[1];  Xian, Jianwei[2];  Yao, Zongxiang[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Aluminum  Lead  Soldered joints  Soldering  Soldering alloys  Substrates  Surface properties  Surface tension  Surfaces  Wetting  Zinc   Comparison of Wettability for Sn-based Solders on Copper and Aluminum Substrates (CPCI-S收录) 会议论文 FUNCTIONAL AND ELECTRONIC MATERIALS 作者:  Yin, Limeng[1];  Xian, Jianwei[2];  Yao, Zongxiang[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Sn-based solder  Wettability  Wetting balance method  Aluminum substrate   FE simulation of size effects on interface fracture characteristics of microscale lead-free solder interconnects (EI收录) 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, August 10, 2009 - August 13, 2009 作者:  Li, Bin[1];  Yin, Limeng[1];  Yang, Yan[1];  Zhang, Xinping[1] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/17 Crack tips  Electronics packaging  Fracture mechanics  Packaging  Silver  Soldered joints  Soldering alloys  Stress analysis  Stress intensity factors  Tin   FE Simulation of Size Effects on Interface Fracture Characteristics of Microscale Lead-Free Solder Interconnects (CPCI-S收录) 会议论文 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009) 作者:  Li, Bin[1];  Yin, Limeng[1];  Yang, Yan[1];  Zhang, Xinping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/17