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浏览/检索结果: 共4条，第1-4条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology 期刊论文 Journal of Alloys and Compounds, 2019, 卷号: 781 作者:  Liu, Shengfa;  Zhang, Dongxiao;  Xiong, Jieran;  Chen, Chen;  Song, Tianjie 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05 Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging 期刊论文 Journal of Electronic Materials, 2018, 卷号: 47, 期号: 9, 页码: 5588-5594 作者:  Liu, Shengfa;  Xiong, Wenyong*;  Xiong, Jieran;  Tan, Guanghua;  Hu, Zhebing 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04 Sn-3.5Ag eutectic solder  rapid solidification  Bi  microstructure   Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 11, 页码: 6373-6380 作者:  Liu, Shengfa;  Hu, Zhebing*;  Xiong, Jieran;  Tan, Guanghua;  Xiong, Wenyong 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/04 Rapid solidification  Sn-3.5Ag eutectic solder ribbon  microstructure  property   Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints 期刊论文 Journal of Electronic Materials, 2017, 卷号: 46, 期号: 11, 页码: 6373-6380 作者:  Liu, Shengfa;  Hu, Zhebing*;  Xiong, Jieran;  Tan, Guanghua;  Xiong, Wenyong 收藏  |  浏览/下载：12/0  |  提交时间：2019/12/04 Rapid solidification  Sn-3.5Ag eutectic solder ribbon  microstructure  property