| Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints | |
| Liu, Shengfa; Hu, Zhebing*; Xiong, Jieran; Tan, Guanghua; Xiong, Wenyong; Chen, Chen; Huang, Shangyu | |
| 刊名 | JOURNAL OF ELECTRONIC MATERIALS
 |
| 2017 | |
| 卷号 | 46期号:11页码:6373-6380 |
| 关键词 | Rapid solidification Sn-3.5Ag eutectic solder ribbon microstructure property |
| ISSN号 | 0361-5235 |
| DOI | 10.1007/s11664-017-5672-9 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000412024000013 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3388820 |
| 专题 | 武汉理工大学 |
| 作者单位 | 1.[Chen, Chen 2.Huang, Shangyu 3.Hu, Zhebing 4.Liu, Shengfa 5.Tan, Guanghua 6.Xiong, Wenyong] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan 430070, Hubei, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Liu, Shengfa,Hu, Zhebing*,Xiong, Jieran,et al. Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints[J]. JOURNAL OF ELECTRONIC MATERIALS,2017,46(11):6373-6380. |
| APA | Liu, Shengfa.,Hu, Zhebing*.,Xiong, Jieran.,Tan, Guanghua.,Xiong, Wenyong.,...&Huang, Shangyu.(2017).Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints.JOURNAL OF ELECTRONIC MATERIALS,46(11),6373-6380. |
| MLA | Liu, Shengfa,et al."Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints".JOURNAL OF ELECTRONIC MATERIALS 46.11(2017):6373-6380. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论