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CORC

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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文
ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Wu, Yingchao
收藏  |  浏览/下载：29/0  |  提交时间：2019/12/02
Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux 期刊论文
THIN SOLID FILMS, 2019, 卷号: 669, 页码: 198-207
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02
Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2019, 卷号: 25, 页码: 499-507
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Wang, Yanfeng;  Ma, Haitao
收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02
Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint 期刊论文
MICROELECTRONIC ENGINEERING, 2019, 卷号: 208, 页码: 47-53
作者:  Shang, Shengyan;  Wang, Yanfeng;  Wang, Yunpeng;  Ma, Haitao;  Kunwar, Anil
收藏  |  浏览/下载：121/0  |  提交时间：2019/12/02
Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Guo, Bingfeng;  Huang, Ru;  Yao, Jinye;  Qi, Xiao;  Kunwar, Anil
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Kunwar, Anil;  Shang, Shengyan;  Raback, Peter;  Song, Xueguan;  Malla, Prafulla Bahadur
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016) 期刊论文
MATERIALS LETTERS, 2018, 卷号: 230, 页码: 76-76
作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02

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