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Discontinuous patterned bonds for semiconductor devices and associated systems and methods 专利
专利号: EP2751831B1, 申请日期: 2018-05-16, 公开日期: 2018-05-16
作者:  SCHELLHAMMER, SCOTT, D.;  ODNOBLYUDOV, VLADIMIR;  FREI, JEREMY, S.
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/24
Etched trenches in bond materials for die singulation, and associated systems and methods 专利
专利号: US8952413, 申请日期: 2015-02-10, 公开日期: 2015-02-10
作者:  ODNOBLYUDOV, VLADIMIR;  SCHELLHAMMER, SCOTT D.;  FREI, JEREMY S.
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/24
Vertical solid-state transducers and solid-state transducer arrays having backside terminals and associated systems and methods 专利
专利号: US20130175560A1, 申请日期: 2013-07-11, 公开日期: 2013-07-11
作者:  ODNOBLYUDOV, VLADIMIR;  SCHUBERT, MARTIN F.;  SCHELLHAMMER, SCOTT D.;  FREI, JEREMY S.
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/30


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