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浏览/检索结果: 共5条，第1-5条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Hole mobility and conductance of iridium complex doped NPB emission layers for organic light-emitting diodes 期刊论文 SYNTHETIC METALS, 2018, 卷号: 244, 页码: 61-65 作者:  Wang, Ying;  Ding, Rongzheng;  Huang, Fobao;  Ma, Dongge 收藏  |  浏览/下载：57/0  |  提交时间：2019/04/09 Hole Mobility  Conductance  Iridium Complex  Npb Emission Layer  Organic Light-emitting Diode   Road Characteristic Identification based on Wavelet Neural Network 会议论文 作者:  Lu Junhui;  Zhou Rongzheng;  Ding Jianjun;  Wu Shijing 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05 Road characteristic identification based on wavelet neural network 期刊论文 IEEE Intelligent Vehicles Symposium, Proceedings, 2009 作者:  Junhui, Lu;  Rongzheng, Zhou;  Jianjun, Ding;  Shijing, Wu 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05 Analysis of error in measurement during destructive double bond pull test (EI收录) 会议论文 ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings, Shanghai, China, October 28, 2003 - October 30, 2003 作者:  Huang, Qiang[1];  Liu, Ying[1];  Guo, Daqi[1];  Ding, Rongzheng[1];  Zhang, Guohua[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/19 Bonding  Electronics packaging  Error analysis  Error correction  Force measurement  Hooks  Microelectronics  Packaging  Position measurement  Testing  Wire   Fabrication of SiC preform for SiC/Al composite in electronic packaging (EI收录) 会议论文 ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings, Shanghai, China, October 28, 2003 - October 30, 2003 作者:  Huang, Qiang[1];  Zhang, Guohua[1];  Ding, Rongzheng[1];  Guo, Daqi[1];  Gu, Mingyuan[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/19 Electronics packaging  Fabrication  Particle size  Powders  Preforming  Rheology  Shear deformation  Shear thinning  Silicon carbide  Solids  Testing  Viscosity