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Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：251/0  |  提交时间：2021/10/15
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载：34/0  |  提交时间：2017/08/17
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
H. F. Zhou; J. D. Guo; Q. S. Zhu; J. K. Shang
收藏  |  浏览/下载：20/0  |  提交时间：2013/12/24
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 11, 页码: 2398-2404
X. N. Du; J. D. Guo; J. K. Shang
收藏  |  浏览/下载：17/0  |  提交时间：2012/04/13
Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
H. F. Zou; Q. S. Zhu; Z. F. Zhang
收藏  |  浏览/下载：16/0  |  提交时间：2012/04/13
Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 卷号: 417, 期号: 1-2, 页码: 143-149
Xia, YH; Xie, XM; Lu, CY; Chang, JL
收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24
Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录) 会议
作者:  Jiang, Han[1];  Liang, Shui-Bao[1];  Yuwen, Hui-Hui[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11

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