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| High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 20
作者: Qiao, Chuang; Sun, Xu; Wang, Youzhi; Hao, Long; Liu, Xiahe
  收藏 | 浏览/下载：17/0 | 提交时间：2021/11/22 |
| Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy 会议论文
7th Electronic System-Integration Technology Conference (ESTC), Dresden, GERMANY, SEP 18-21, 2018
作者: Zhou, Zhaoxia*; Liu, Li; Liu, Changqing
收藏 | 浏览/下载：8/0 | 提交时间：2019/12/04
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| Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate 期刊论文
科学通报 英文版, 2012
Zang LiKun; Yuan ZhangFu; Zhan YaPeng; Wang ChenYu; Xu BingSheng
收藏 | 浏览/下载：4/0 | 提交时间：2015/11/12
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| Study on the performances of several laminated Bi-2223/Ag high temperature superconductor tape composite structures 期刊论文
2010, 2010
Ding Shi-yu; Song Xiu-hua; Zhang Jin-song; Han Bing; Liu Li; Liu Rui; Chen Shan-shan; Sun Hai-bo; Sun Jian-feng; Han Zheng-he
收藏 | 浏览/下载：11/0 |
| 印制电路板分层改善研究 期刊论文
2010, 2010
陈闰发; CHEN Run-fa
收藏 | 浏览/下载：4/0 |
| Sn基多组元高温无铅焊接材料的设计及性能研究 学位论文
2009, 2009
李元源
收藏 | 浏览/下载：3/0 | 提交时间：2016/02/14
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| Mechanical fatigue of Sn-rich Pb-free solder alloys 期刊论文
Journal of Materials Science-Materials in Electronics, 2007, 卷号: 18, 期号: 1-3, 页码: 211-227
J. K. Shang; Q. L. Zeng; L. Zhang; Q. S. Zhu
收藏 | 浏览/下载：16/0 | 提交时间：2012/04/13
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