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| Novel Underfill Material Having Low Coefficeint of Thermal Expansione 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Zhang Baotan; Sun Rong; Zhu Pengli
  收藏 | 浏览/下载：16/0 | 提交时间：2017/01/15 |
| Insights into the role of surface hydroxyl of the silica fillers in the bulk properties of resulting underfills 会议论文
The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China
作者: Gang Li; Pengli Zhu; Qian Guo; Rong Sun; Daoqiang (Daniel) Lu
收藏 | 浏览/下载：10/0 | 提交时间：2016/01/27 |
| Lifetime of solder joint and delamination in flip chip assemblies 期刊论文
2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186
Cheng, ZN
收藏 | 浏览/下载：28/0 | 提交时间：2012/03/24
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| Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
作者: Liu S; Zhao YP(赵亚溥) ; Zhao YP(赵亚溥); Liu S; Liu S
收藏 | 浏览/下载：10/0 | 提交时间：2014/02/14
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| The effects of underfill and its material models on thermomechanical behaviors of a flip chip package 期刊论文
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 卷号: 24, 期号: 1, 页码: 17-24
Chen, L; Zhang, Q; Wang, GZ; Xie, XM; Cheng, ZN
收藏 | 浏览/下载：26/0 | 提交时间：2012/03/24
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| Effect of hygrothermal aging on interfacial reliability of silicon/ underfill/FR-4 assembly 期刊论文
Daihe
收藏 | 浏览/下载：1/0 |
| Effect of hygrothermal aging on interfacial reliability of silicon/underfill/FR-4 assembly 期刊论文
张亦良
收藏 | 浏览/下载：1/0 |
