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	Insights into the role of surface hydroxyl of the silica fillers in the bulk properties of resulting underfills
	Gang Li; Pengli Zhu; Qian Guo; Rong Sun; Daoqiang (Daniel) Lu; Chingping Wong
	2015
会议名称	The 16th International Conference on electronic packing Technology (ICEPT 2015)
会议地点	Changsha,China
英文摘要	The advances of flip-chip technology have driven the development of both underfilling processes and underfill materials. Current underfill material is mainly silica filled liquid epoxy encapsulant and their properties depends to a large extent on the filler factors such as loading, size and size distribution, shape, and especially surface chemistry state. To illustrate this point, in our study, monodisperse spherical SiO2 particles with plenty of hydroxyl groups have been synthesized via the Stöber process and further thermally treated to obtain -OH-free SiO2 particles. Then the anhydride based underfill filled with the two types of silica filler were prepared and their performances were evaluated comparatively in order to provide insights into the role of intrinsic surface hydroxyl of the silica fillers in the bulk properties of resulting underfills. We found that as compared to the -OH-free SiO2 filled epoxy underfills, the presence of the surface -OH groups of silica lead to negative effects on the rheological, thermomechanical as well as reliability properties of resulting underfills, such as a sharper viscosity increase with time, an obvious decrease in glass transition temperature (Tg), the interfacial thermal stresses harder to eliminate, a much higher moisture absorption. Therefore it was necessary to remove the surface -OH groups of SiO2 fillers through pre-heat treatment to develop high performance underfills.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/6758]
专题	深圳先进技术研究院_集成所
作者单位	2015
推荐引用方式 GB/T 7714	Gang Li,Pengli Zhu,Qian Guo,et al. Insights into the role of surface hydroxyl of the silica fillers in the bulk properties of resulting underfills[C]. 见:The 16th International Conference on electronic packing Technology (ICEPT 2015). Changsha,China.

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