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A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Kunwar, Anil;  Shang, Shengyan;  Raback, Peter;  Song, Xueguan;  Malla, Prafulla Bahadur
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文
Harbin
作者:  Gang Li;  yachuan He;  Pengli Zhu;  Tao Zhao;  Rong Sun
收藏  |  浏览/下载：36/0  |  提交时间：2018/02/02
Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation 期刊论文
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他
2016-01-01
Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball 会议论文
作者:  Liu, Sheng;  Zhang, Honghai;  Su, Dan;  Li, Xiaotian;  Liao, Daokun
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/05
Study on the electromigration-induced failure mechanism of Sn-3.0 Ag-0.5Cu BGA solder balls 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
作者:  Qiu, Yan;  Huang, Mingliang;  Wu, Aimin
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Study on the electronmigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls 会议论文
17th International Conference on Electronic Packaging Technology Wuhan
作者:  Huang ML(黄明亮);  Wu AM(吴爱民)
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Study on the electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls 会议论文
17th International Conference on Electronic Packaging Technology, ICEPT 2016, 2016-08-16
作者:  Qiu Y.;  Huang M.;  Wu A.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文
18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30
作者:  Liu, Huan;  Zeng, Qinghua;  Guan, Yong;  Fang, Runiu;  Sun, Xin
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30

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