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CORC

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Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:  Zhang, Sinan;  Wang Z(王臻);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
收藏  |  浏览/下载：21/0  |  提交时间：2022/08/22
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
Applications of single-atom catalysts 期刊论文
Nano Research, 2022, 卷号: 15, 期号: 1, 页码: 38-70
作者:  Q. Q. Zhang and J. Q. Guan
收藏  |  浏览/下载：13/0  |  提交时间：2022/06/13
Palladium-Catalyzed Tandem Carbonylative Aza-Wacker-Type Cyclization of Nucleophile Tethered Alkene to Access Fused N-Heterocycles 期刊论文
Chinese Journal of Chemistry, 2021, 卷号: 39, 期号: 2, 页码: 317-322
作者:  Shi Lijun;  Wen Mingshan;  Li Fuwei
收藏  |  浏览/下载：20/0  |  提交时间：2021/11/20
Structure-composition-property correlations of symmetrical tilt grain boundaries in copper-based binary alloys 期刊论文
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 2021, 卷号: 154, 页码: 9
作者:  Xue, Hongtao;  Lei, Chao;  Tang, Fuling;  Li, Xiuyan;  Luo, Yaqiao
收藏  |  浏览/下载：53/0  |  提交时间：2021/10/15
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：17/0  |  提交时间：2021/10/14
Structure-composition-property correlations of symmetrical tilt grain boundaries in copper-based binary alloys 期刊论文
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 2021, 卷号: 154
作者:  Xue, Hongtao;  Lei, Chao;  Tang, Fuling;  Li, Xiuyan;  Luo, Yaqiao
收藏  |  浏览/下载：2/0  |  提交时间：2021/10/14
Structurecomposition-property correlations of symmetrical tilt grain boundaries in copper-based binary alloys 期刊论文
Journal of Physics and Chemistry of Solids, 2021, 卷号: 154
作者:  Xue, Hongtao;  Lei, Chao;  Tang, Fuling;  Li, Xiuyan;  Luo, Yaqiao
收藏  |  浏览/下载：8/0  |  提交时间：2021/06/03
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：12/0  |  提交时间：2022/02/17
一种薄膜样品全自动裁切方法与装置 专利
专利号: ZL201910879174.2, 申请日期: 2021-03-02,
作者:  花昌义;  李志刚;  叶超;  王善锋;  孙淼
收藏  |  浏览/下载：55/0  |  提交时间：2021/12/14

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