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CORC

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Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ;  Wang BY;  Chen L;  Chen L
收藏  |  浏览/下载：53/0  |  提交时间：2019/11/27
Assembly of 2-dimensional matrix of optical transmitter or receiver based on wet etched silicon interposer 专利
专利号: WO2019048653A1, 申请日期: 2019-03-14, 公开日期: 2019-03-14
作者:  LI, CHENHUI;  RAZ, ODED;  STABILE, RIPALTA
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187
作者:  Zhang, Hui;  Li, Jianfeng;  Dai, Jingru;  Corfield, Martin;  Liu, Xuejian
收藏  |  浏览/下载：31/0  |  提交时间：2018/12/28
Investigation of microstructure and properties of ultrathin graded ZrNx self-assembled diffusion barrier in deep nano-vias prepared by plasma ion immersion implantation. 期刊论文
APPLIED SURFACE SCIENCE, 2018
作者:  Zou, Jianxiong;  Liu, Bo;  Lin, Liwei;  Lu, Yuanfu;  Dong, Yuming
收藏  |  浏览/下载：40/0  |  提交时间：2019/01/31
圆柱形硅通孔的二维解析电容模型 期刊论文
2016, 2016
张青青; 喻文健; 骆祖莹; ZHANG Qing-Qing; YU Wen-Jian; LUO Zu-Ying
收藏  |  浏览/下载：1/0
Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration 期刊论文
MICROELECTRONIC ENGINEERING, 2016
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Guan, Yong; Miao, Min; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
考虑通孔电阻和耦合电容的时延驱动的层分配算法 期刊论文
2010, 2010
贾艳明; 蔡懿慈; 洪先龙; Jia Yanming; Cai Yici; Hong Xianlong
收藏  |  浏览/下载：2/0
High aspect ratio copper through-silicon-vias for 3D integration 期刊论文
2010, 2010
Chongshen Song; Zheyao Wang; Qianwen Chen; Jian Cai; Litian Liu
收藏  |  浏览/下载：2/0
High aspect ratio copper through-silicon-vias for 3D integration 会议论文
MICROELECTRONIC ENGINEERING, 12th European Workshop on Materials for Advanced Metallization, Dresden, GERMANY, Web of Science
Song, Chongshen; Wang, Zheyao; Chen, Qianwen; Cai, Jian; Liu, Litian
收藏  |  浏览/下载：5/0

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