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	Assembly of 2-dimensional matrix of optical transmitter or receiver based on wet etched silicon interposer
	LI, CHENHUI; RAZ, ODED; STABILE, RIPALTA
	2019-03-14
著作权人	TECHNISCHE UNIVERSITEIT EINDHOVEN
专利号	WO2019048653A1
国家	世界知识产权组织
文献子类	发明申请
其他题名	Assembly of 2-dimensional matrix of optical transmitter or receiver based on wet etched silicon interposer
英文摘要	An optical interconnect includes CMOS drivers/receivers, vertical cavity surface emitting lasers (VCSEL) or photo detectors (PD), a silicon interposer having a electrical interface connected to a pattern of wet etched square-box shape optical through silicon vias (OTSV), the CMOS drivers/receivers are connected to the electrical interface, the VCSEL/PDs are connected to the end of the electrical interface, each input/output signal of the VCSEL/PDs are aligned with the pattern of OTSVs, an optical interface (01) connected to a second side of the interposer, the optical interface is aligned with the OTSVs, the optical interface planar surface is on the silicon interposer second side and a pattern lenses opposite the planar surface and match the OTSVs, and a lensed ferrule having a pattern of lenses arranged to match the pattern of optical interface lenses, the ferrule connects with optical fiber arrays to directly connect to all the drivers or receivers.
公开日期	2019-03-14
申请日期	2018-09-07
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/55077]
专题	半导体激光器专利数据库
作者单位	TECHNISCHE UNIVERSITEIT EINDHOVEN
推荐引用方式 GB/T 7714	LI, CHENHUI,RAZ, ODED,STABILE, RIPALTA. Assembly of 2-dimensional matrix of optical transmitter or receiver based on wet etched silicon interposer. WO2019048653A1. 2019-03-14.

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