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Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor
期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
作者:
Wei, Xiang-Fu
;
Zhu, Qing-Sheng
;
Guo, Jing-Dong
;
Shang, Jian-Ku
收藏
  |  
浏览/下载:37/0
  |  
提交时间:2021/11/22
Copper electroplating
Throwing power (TP)
Flexible printed circuit (FPC)
Suppressor
Highly selective capacitive deionization of copper ions in FeS2@N, S co-doped carbon electrode from wastewater
期刊论文
SEPARATION AND PURIFICATION TECHNOLOGY, 2021, 卷号: 262
作者:
Gao, Yong
;
Li, Zhaolei
;
Fu, Zhen
;
Zhang, Haimin
;
Wang, Guozhong
收藏
  |  
浏览/下载:77/0
  |  
提交时间:2021/05/17
Capacitive deionization
Heavy metal ions
Electrosorption
Faradic electrode
Selective adsorption
Highly thermal-conductive graphite flake/Cu composites prepared by sintering intermittently electroplated core-shell powders
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 卷号: 61, 页码: 93-99
作者:
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2021/03/29
Graphite flake
Electroplating
Powder processing
Thermal properties
Study on the microstructure and properties of a phosphor copper ball during its formation process
期刊论文
MATERIALS RESEARCH EXPRESS, 2021, 卷号: 8, 期号: 4
作者:
Zhang, Zhongke
;
Li, Zhao
;
Zhao, Changzhong
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  |  
浏览/下载:3/0
  |  
提交时间:2021/06/03
continuous extrusion and upsetting
phosphor copper
EBSD
microstructure
A Global Assessment of Copper, Zinc, and Lead Isotopes in Mineral Dust Sources and Aerosols
期刊论文
FRONTIERS IN EARTH SCIENCE, 2020, 卷号: 8, 页码: 20
作者:
Schleicher, Nina J.
;
Dong, Shuofei
;
Packman, Hollie
;
Little, Susan H.
;
Ochoa Gonzalez, Raquel
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  |  
浏览/下载:18/0
  |  
提交时间:2020/09/08
isotopes
mineral dust
urban aerosols
anthropogenic
sources
MC-ICP-MS
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:
Yi, Xiong
;
Yi, Guangbin
;
Hu, Xiaowu
;
Li, Qinglin
;
Zhang, Ruhua
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Atomic force microscopy
Coatings
Copper compounds
Electroplating
Gold
Growth rate
Lead-free solders
Metallic films
Scanning electron microscopy
Semiconductor doping
Silver alloys
Silver metallography
Soldering
Substrates
Surface roughness
Ternary alloys
Thermal aging
Tin alloys
Tin compounds
Tin metallography
X ray photoelectron spectroscopy
Benzotriazole(BTA)
Electroplated Cu films
Heterocyclic compound
Interfacial microstructure evolution
Isothermal aging
Kovar substrates
Low concentrations
Soldering process
Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 810, 页码: 7
作者:
Sun, Hong
;
Guo, Lijiang
;
Deng, Nan
;
Li, Xiaoyu
;
Li, Jiangtao
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  |  
浏览/下载:90/0
  |  
提交时间:2019/11/12
Metal matrix composites
Electroplating
Sintering
Thermal conductivity
W-Cu composites with homogenous Cu-network structure prepared by spark plasma sintering using core-shell powders
期刊论文
INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2019, 卷号: 82, 页码: 310-316
作者:
Deng, Nan
;
Zhou, Zhangjian
;
Li, Jianqiang
;
Wu, Yuchuan
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  |  
浏览/下载:47/0
  |  
提交时间:2019/09/03
W-Cu composites
Electroplating
Cu-network structure
Core-shell powder
W-W contiguity
Coprecipitation Preparation of Cu/Zn/Al-Hydrotalcite-Like Compound for Copper Removal from Electroplating Wastewater
期刊论文
2019
作者:
Bai, Dekui
;
Wang, Xiaofang
;
Huo, Dongxia
;
Ying, Quanhong
;
Wang, Ni
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/13
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