中国开放科研知识云: 检索

Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者: Gao, Li-Yin; Cui, Xian-Wei; Tian, Fei-Fei; Liu, Zhi-Quan

收藏 | 浏览/下载：46/0 | 提交时间：2021/02/02

Mixed soldering ball grid array solidification crack shrinkage failure mechanism

Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者: Gao, Li-Yin; Cui, Xian-Wei; Tian, Fei-Fei; Liu, Zhi-Quan

收藏 | 浏览/下载：42/0 | 提交时间：2021/02/02

Mixed soldering ball grid array solidification crack shrinkage failure mechanism

Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者: Bi, Xiaoyang; Hu, Xiaowu; Li, Qinglin

收藏 | 浏览/下载：16/0 | 提交时间：2022/03/01

Solder joints Ni-Co film Shear strength Atomic model Intermetallic compound First-principles calculations

Photonic die fan out package with edge fiber coupling interface and related methods 专利
专利号: US20190285804A1, 申请日期: 2019-09-19, 公开日期: 2019-09-19
作者: RAMACHANDRAN, KOUSHIK; FASANO, BENJAMIN V.; BLACKSHEAR, EDMUND D.

收藏 | 浏览/下载：34/0 | 提交时间：2019/12/30

Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析] 期刊论文
Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University, 2019, 卷号: 46, 页码: 54-60
作者: Zhao, F.; Qiu, Y.; Jia, F.; Ma, H.

收藏 | 浏览/下载：2/0 | 提交时间：2019/12/30

Ball grid arrays Chip scale packages Fatigue damage Soldered joints Stress analysis Thermal cycling Thermal stress Vibration analysis Coffin-Manson equation Electronic Packaging Fatigue lifetime Incremental damage superposition approach Plastic ball grid array packages Temperature environments Unified viscoplasticity Vibration loading Thermal fatigue

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing thereof 专利
专利号: US9835797, 申请日期: 2017-12-05, 公开日期: 2017-12-05
作者: DUTTA, ACHYUT KUMAR

收藏 | 浏览/下载：12/0 | 提交时间：2019/12/24

A micro-CL system and its applications 期刊论文
REVIEW OF SCIENTIFIC INSTRUMENTS, 2017, 卷号: 88, 期号: 11
作者: Wei, Zenghui; Yuan, Lulu; Liu, Baodong; Wei, Cunfeng; Sun, Cuili

收藏 | 浏览/下载：27/0 | 提交时间：2019/04/28

A micro-cl system and its applications 期刊论文
Review of scientific instruments, 2017, 卷号: 88, 期号: 11, 页码: 6
作者: Wei, Zenghui; Yuan, Lulu; Liu, Baodong; Wei, Cunfeng; Sun, Cuili

收藏 | 浏览/下载：41/0 | 提交时间：2019/04/23

A micro-CL system and its applications 期刊论文
REVIEW OF SCIENTIFIC INSTRUMENTS, 2017, 卷号: 88, 期号: 11, 页码: 115107
作者: Wei, Zenghui; Wei, Long; Yin, Pengfei; Sun, Cuili; Wei, Cunfeng

收藏 | 浏览/下载：39/0 | 提交时间：2019/08/27

Optoelectronic ball grid array package with fiber 专利
专利号: US20160124164A1, 申请日期: 2016-05-05, 公开日期: 2016-05-05
作者: DOERR, CHRISTOPHER

收藏 | 浏览/下载：6/0 | 提交时间：2019/12/30

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