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	Photonic die fan out package with edge fiber coupling interface and related methods
	RAMACHANDRAN, KOUSHIK; FASANO, BENJAMIN V.; BLACKSHEAR, EDMUND D.
	2019-09-19
著作权人	GLOBALFOUNDRIES INC.
专利号	US20190285804A1
国家	美国
文献子类	发明申请
其他题名	Photonic die fan out package with edge fiber coupling interface and related methods
英文摘要	A photonic integrated circuit (PIC) fan-out package and related methods of forming same are disclosed. The PIC fan-out package includes: an overmold body; a PIC die in the overmold body, the PIC die including electro-optic circuitry; a plurality of optical fiber stubs operatively coupled to the electro-optic circuitry; an edge fiber coupling interface in a lateral side of the overmold body for coupling the plurality of optical fiber stubs to external optical fibers using a connector; an ancillary device in the overmold body; a redistribution wiring layer (RDL) interposer adjacent the overmold body and electrically connected to the PIC die and the ancillary device; and a ball grid array (BGA) electrically coupled to the PIC die and the ancillary device by the RDL interposer, the BGA configured to electrically couple the PIC die and the ancillary device to a printed circuit board (PCB).
公开日期	2019-09-19
申请日期	2018-03-14
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54869]
专题	半导体激光器专利数据库
作者单位	GLOBALFOUNDRIES INC.
推荐引用方式 GB/T 7714	RAMACHANDRAN, KOUSHIK,FASANO, BENJAMIN V.,BLACKSHEAR, EDMUND D.. Photonic die fan out package with edge fiber coupling interface and related methods. US20190285804A1. 2019-09-19.

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