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北京大学 [4]
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期刊论文 [9]
会议论文 [2]
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Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating
期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:
Gao, Li-Yin
;
Wan, Peng
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2021/02/02
Fe-Ni
Electrodeposition
Transmission electron microscopy (TEM)
Interfacial structure
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating
期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:
Gao, Li-Yin
;
Wan, Peng
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2021/02/02
Fe-Ni
Electrodeposition
Transmission electron microscopy (TEM)
Interfacial structure
A 3D MEMS In-Chip Solenoid Inductor of High Inductance Density for Future Power-MEMS Device
会议论文
20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Berlin, Germany, 2019-06-23
作者:
Xu, Tiantong
;
Sun, Jiamian
;
Wu, Hanxiao
;
Li, Haiwang
;
Li, Hanqing
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/30
3D MEMS In-Chip Solenoid Inductor With High Inductance Density for Power MEMS Device
期刊论文
IEEE ELECTRON DEVICE LETTERS, 2019, 卷号: 40, 页码: 1816-1819
作者:
Xu, Tiantong
;
Sun, Jiamian
;
Wu, Hanxiao
;
Li, Haiwang
;
Li, Hanqing
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/30
Inductors
Inductance
Iron
Micromechanical devices
Solenoids
Substrates
Silicon
Solenoid inductor
power MEMS
high inductance density
CMOS-compatible fabrication process
Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor
期刊论文
MICROMACHINES, 2018, 卷号: 9
作者:
Li, Haiwang
;
Liu, Jiasi
;
Xu, Tiantong
;
Xia, Jingchao
;
Tan, Xiao
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/30
through-silicon-vias (TSV)
high aspect ratio
control variable method
electroplating
three-dimensional (3D) inductor
Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials
期刊论文
SCIENCE ADVANCES, 2016
Yan, Zheng
;
Zhang, Fan
;
Liu, Fei
;
Han, Mengdi
;
Ou, Dapeng
;
Liu, Yuhao
;
Lin, Qing
;
Guo, Xuelin
;
Fu, Haoran
;
Xie, Zhaoqian
;
Gao, Mingye
;
Huang, Yuming
;
Kim, JungHwan
;
Qiu, Yitao
;
Nan, Kewang
;
Kim, Jeonghyun
;
Gutruf, Philipp
;
Luo, Hongying
;
Zhao, An
;
Hwang, Keh-Chih
;
Huang, Yonggang
;
Zhang, Yihui
;
Rogers, John A.
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  |  
浏览/下载:110/0
  |  
提交时间:2017/12/04
3D Assembly,buckling,microfabrication,multilayer,near field communication
NEAR-FIELD COMMUNICATION
STRETCHABLE ELECTRONICS
OPTICAL-DEVICES
MICROSTRUCTURES
ARCHITECTURES
FABRICATION
ORIGAMI
METAMATERIALS
CAPABILITIES
DEFORMATION
Simple and accurate inductance model of 3D inductor based on TSV
期刊论文
2016, 卷号: 52, 页码: 1815-1816
作者:
Wang, Fengjuan
;
Yu, Ningmei
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/20
three-dimensional integrated circuits
inductors
solenoids
finite element analysis
integrated circuit modelling
on-chip inductors
integrated circuit application
through-silicon via
TSV
3D inductor
solenoid architecture
finite element method
Parylene-based 3D high performance folded multilayer inductors for wireless power transmission in implanted applications
期刊论文
sensors and actuators a physical, 2014
Sun, Xuming
;
Zheng, Yang
;
Peng, Xuhua
;
Li, Xiuhan
;
Zhang, Haixia
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2015/11/10
MEMS inductors
Wireless power transmission
Parylene
Folding
Bio-implanted
RETINAL PROSTHESES
NEUROSTIMULATOR
ENDOSCOPY
SYSTEM
CORE
COIL
STACKED FLEXIBLE PARYLENE-BASED 3D INDUCTORS WITH NI80FE20 CORE FOR WIRELESS POWER TRANSMISSION SYSTEM
其他
2013-01-01
Sun, Xuming
;
Zheng, Yang
;
Li, Zhongliang
;
Li, Xiuhan
;
Zhang, Haixia
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2015/11/13
Stacked flexible parylene-based 3D inductors with Ni80Fe 20 core for wireless power transmission system
其他
2013-01-01
Sun, Xuming
;
Zheng, Yang
;
Li, Zhongliang
;
Li, Xiuhan
;
Zhang, Haixia
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2015/11/13
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