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A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules 会议论文
Hong Kong, China, August 12, 2019 - August 15, 2019
作者:  Tian, Jun;  Wang, Congsi;  Liu, Shaoyi;  Zhu, Cheng;  Zhou, Cheng
收藏  |  浏览/下载：18/0  |  提交时间：2021/07/06
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks 会议论文
作者:  Wen, Junxia;  Che, Hongyan;  Cao, Rui;  Dong, Hao;  Ye, Youxiong
收藏  |  浏览/下载：2/0  |  提交时间：2020/12/18
High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning
收藏  |  浏览/下载：11/0  |  提交时间：2020/05/18
Preparation of an intelligent pH film based on biodegradable polymers and roselle anthocyanins for monitoring pork freshness 会议论文
FOOD CHEMISTRY, 2019-01-30
作者:  Zhang, Junjun[1];  Zou, Xiaobo[2];  Zhai, Xiaodong[3];  Huang, XiaoWei[4];  Jiang, Caiping[5]
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/24
Control Network Reconstruction of Nickel Plates Packaging System 会议论文
Dalian, PEOPLES R CHINA, DEC 21-22, 2018
作者:  Zhao Zhengtian;  Rui Zhiyuan;  Duan Xiaoyan
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/09
Control Network Reconstruction of Nickel Plates Packaging System 会议论文
作者:  Zhao Zhengtian;  Rui Zhiyuan;  Duan Xiaoyan
收藏  |  浏览/下载：0/0  |  提交时间：2019/11/15
The analysis about the application of nanomaterials in food packaging 会议论文
2018 International Conference on Advanced Electronic Materials, Computers and Materials Engineering, AEMCME 2018, Singapore, Singapore, 2018-09-14
作者:  Lizhao, Huang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Study on Electrochemical Migration of Sn-0.7Cu 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Qi, Xiao;  Ma, Haoran;  Huang, Ru;  Yao, Jinye;  Shang, Shengyan
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02

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