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华南理工大学 [22]

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会议论文 [37]

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	The analysis about the application of nanomaterials in food packaging 会议论文 2018 International Conference on Advanced Electronic Materials, Computers and Materials Engineering, AEMCME 2018, Singapore, Singapore, 2018-09-14 作者: Lizhao, Huang 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/02 Nanostructured materials Packaging machines, Food packaging Nanometer material, Packaging materials
	Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者: Li, T.; Yao, R.; Yu, C.; Su, F. 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/30 Cracks Elasticity Electronics packaging Light polarization Microscopes Optical devices Silicon carbide Silicon wafers Stresses Wafer bonding Wide band gap semiconductors Electronic Packaging Heating platform Phase difference Quarter wave-plate Si-based materials Silicon-based materials Stress birefringence Temperature cycling tests Three dimensional integrated circuits
	Fabrication of embedded piezoelectric sensors and its application in traffic engineering 会议论文 Singapore, Singapore, September 1, 2017 - September 3, 2017 作者: Zhang, Xingjun; Song, Shanglin; Yao, Ming Jie 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/15 3D printers Aggregates Composite materials Concrete aggregates Concrete buildings Concrete construction Electric sensing devices Epoxy resins Glass ceramics Highway engineering Mean square error Monitoring Packaging materials Piezoelectric ceramics Piezoelectric devices Piezoelectric transducers Piezoelectricity Structural health monitoring Traffic control Health monitoring Piezoelectric sensors Service performance Traffic monitoring Working performance
	Dielectric properties of graphene-filled epoxy nanocomposite with enhanced thermal conductivity 会议论文作者: Li, He; Tian, Huidong; Cai, Mengchu; Gong, Ao; Zhou, Ziyu 收藏 \| 浏览/下载：13/0 \| 提交时间：2019/11/26 Advanced dielectric materials Application of polymers Electronic Packaging Enhanced thermal conductivity Epoxy nanocomposites Graphene nanosheets High thermal conductivity Thermo-gravimetric properties
	Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者: Yuan, Guangjie[1]; Shan, Bo[2]; Chen, Shujing[3]; Yang, Yiqun[4] 收藏 \| 浏览/下载：6/0 \| 提交时间：2019/04/24 heat spreading materials graphene-based film graphene-based electrically conductive adhesive electronics packaging
	Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文 18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30 作者: Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/12/30 Chip scale packages Electronics packaging Failure (mechanical) Fatigue of materials Finite element method Shear stress Soldering Stresses Thermal load Timing circuits Global simulation Interfacial failures Load condition Maximum principal stress Resistance measurement Solder balls Thermal mechanical stress Thermal-mechanical reliability Three dimensional integrated circuits
	The Potential Applications of W- and Mo-doped VO2 Nanobelts to the Functional Packaging Materials 会议论文作者: Zhang, Yifu; Fan, Meijuan; Huang, Chi; Liu, Xinghai; Liu, Xin 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/12/05 Nanomaterials Functional packaging materials VO2 Doped Phase transition
	Thermal modeling and analysis of high power semiconductor laser arrays 会议论文作者: Zhang, Zhiyong; Zhang, Pu; Li, Xiaoning; Xiong, Lingling; Liu, Hui 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/10 Diamond composite materials High power semiconductor laser Packaging structure Quasi-continuous waves Semiconductor laser arrays Thermal Performance Three dimensional thermal model Transient thermal characteristics
	Determination of Cadmium Content in the Food Paper and Plastic Packaging Materials with Wet Digestion-flame Atomic Absorption Spectrometry 会议论文 2012 International Conference on Biobase Material Science and Engineering, BMSE 2012, Changsha, China, October 21, 2012 - October 23, 2012 作者: Peng Xiang-lian; Li Zhong-hai*; Qiang Dun-zhi 收藏 \| 浏览/下载：6/0 \| 提交时间：2019/12/28 paper and plastic packaging materials cadmium wet digestion flame atomic absorption spectrometry
	An environmental friendly based research on the safety of food packing materials 会议论文作者: Gao, Zhiyong; Huang, Zengguang 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/05 green designing green packaging food packaging packing materials

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