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Development of Versatile and Flexible Sf9 Packaging Cell Line-Dependent OneBac System for Large-Scale Recombinant Adeno-Associated Virus Production 期刊论文
HUMAN GENE THERAPY METHODS, 2019, 卷号: 30, 期号: 5, 页码: 172-183
作者:  Wu, Yang;  Mei, Ting;  Jiang, Liangyu;  Han, Zengpeng;  Dong, Ruping
收藏  |  浏览/下载：90/0  |  提交时间：2020/01/14
Rna-binding motif protein 24 (rbm24) is involved in pregenomic rna packaging by mediating interaction between hepatitis b virus polymerase and the epsilon element 期刊论文
Journal of virology, 2019, 卷号: 93, 期号: 6, 页码: 17
作者:  Yao, Yongxuan;  Yang, Bo;  Chen, Yingshan;  Wang, Hui;  Hu, Xue
收藏  |  浏览/下载：501/0  |  提交时间：2019/05/08
Preparation of polyacrylic acid-grafted-acryloyl/hemicellulose (PAA-g-AH) hybrid films with high oxygen barrier performance 期刊论文
CARBOHYDRATE POLYMERS, 2019, 卷号: 205, 页码: 83-88
作者:  Liu, Ran;  Du, Jian;  Zhang, Zepeng;  Li, Haiming;  Lu, Jie
收藏  |  浏览/下载：65/0  |  提交时间：2018/12/21
RNA-Binding Motif Protein 24 (RBM24) Is Involved in Pregenomic RNA Packaging by Mediating Interaction between Hepatitis B Virus Polymerase and the Epsilon Element 期刊论文
JOURNAL OF VIROLOGY, 2019, 卷号: 93, 期号: 6
作者:  Chen, Yingshan;  Niu, Junqi;  Lu, Mengji;  Gao, Xiuzhu;  Zhou, Yuan
收藏  |  浏览/下载：44/0  |  提交时间：2019/12/05
Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
The Pouring Process Optimization for the Conductive Slip-Rin 期刊论文
Materials Science Forum, 2019, 卷号: Vol.943, 页码: 5
作者:  Zhang, K.L.a;  Hong, B.a;  Zhang, L.P.a;  Ji, Y.b;  Gao, Z.D.b
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/21
Influence of packaging materials on postharvest physiology and texture of garlic cloves during refrigeration storage 期刊论文
Food Chemistry, 2019, 卷号: Vol.298
作者:  He, Y.;  Fan, G.-J.;  Wu, C.-E.;  Kou, X.;  Li, T.-T.
收藏  |  浏览/下载：16/0  |  提交时间：2019/11/21
A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds 期刊论文
Materials Science Forum, 2019, 卷号: Vol.943, 页码: 5
作者:  Hong, B.a;  Gao, Z.D.b;  Gao, J.Y.b;  Ji, Y.b;  Lv, S.Y.b
收藏  |  浏览/下载：10/0  |  提交时间：2019/11/21
The Soaking Process Optimization for the Conductive Slip-Ring 期刊论文
Materials Science Forum, 2019, 卷号: Vol.943, 页码: 5
作者:  Zhang, L.P.a;  Hong, B.a;  Zhang, K.L.a;  Gao, J.Y.b;  Ji, Y.b
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/21
Research on the production scheduling method of a semiconductor packaging test based with the clustering method 期刊论文
International Journal of Information Systems and Supply Chain Management, 2019, 卷号: 12, 期号: 2, 页码: 36-56
作者:  Zhang Q(张权);  Duan B(段彬);  Jiang, Yongqing;  Han ZH(韩忠华)
收藏  |  浏览/下载：30/0  |  提交时间：2019/07/14

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