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武汉大学 [14]
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期刊论文 [36]
会议论文 [8]
其他 [8]
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2017 [52]
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Polymer Sc... [1]
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Fabrication of embedded piezoelectric sensors and its application in traffic engineering
会议论文
Singapore, Singapore, September 1, 2017 - September 3, 2017
作者:
Zhang, Xingjun
;
Song, Shanglin
;
Yao, Ming Jie
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/11/15
3D printers
Aggregates
Composite materials
Concrete aggregates
Concrete buildings
Concrete construction
Electric sensing devices
Epoxy resins
Glass ceramics
Highway engineering
Mean square error
Monitoring
Packaging materials
Piezoelectric ceramics
Piezoelectric devices
Piezoelectric transducers
Piezoelectricity
Structural health monitoring
Traffic control
Health monitoring
Piezoelectric sensors
Service performance
Traffic monitoring
Working performance
Gas Purge Microsyringe Extraction Coupled with Dispersive Liquid-Liquid Microextraction for the Determination of Acidic Compounds in Food Packaging Materials
期刊论文
food analytical methods, 2017, 卷号: 10, 期号: 5, 页码: 1164-1171
作者:
Zhang, Shijuan
;
Sheng, Cuncun
;
Zhang, Jiangchunzi
;
Li, Yanxin
;
You, Jinmao
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2017/06/23
Acidic compounds
Food packaging materials
GP-MSE
HPLC
Pseudo-typed Semliki Forest virus delivers EGFP into neurons
期刊论文
JOURNAL OF NEUROVIROLOGY, 2017, 卷号: 23, 期号: 2, 页码: 205-215
作者:
Miao, Huan
;
Xu, Fuqiang
;
Zhu, Xutao
;
Jia, Fan
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2017/11/23
Semliki Forest Virus
Replication-competent Vlps
Packaging Sequence
Pseudo-typed Sfv
Vsvg
Rvg
An introduction of resistive arrays and packaging technology
会议论文
作者:
Sun Q
;
Liu DF
;
Gong HM
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2018/11/20
Resistor arrays
Packaging technology
Infrared scene simulation
DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP
会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12
作者:
Yao, Mingjun
;
Yu, Daquan
;
Zhao, Ning
;
Fan, Jun
;
Xiao, Zhiyi
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Hybrid bonding
3D packaging
Bump
Polyimide
Dry film
A Novel High-Speed Jet Dispenser Driven by Double Piezoelectric Stacks
期刊论文
IEEE Transactions on Industrial Electronics, 2017, 卷号: 64, 期号: 1, 页码: 412-419
作者:
Zhou, Can*
;
Duan, Ji-An
;
Deng, Guiling
;
Li, Junhui
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/03
Bi-piezoelectric jet
mechanical-electrical fluid simulation
microelectronics packaging
physical models
zoom mechanism
Review on Brazing of High Volume Faction SiCp/Al Composites for Electronic Packaging Applications
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2017, 卷号: 46, 页码: 2812-2819
作者:
Zhang, Xiangzhao
;
Zhao, Santuan
;
Liu, Guiwu
;
Xu, Ziwei
;
Shao, Haicheng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/11/26
Electronic packaging applications
Electronic packaging material
Interfacial behaviors
Joint microstructures
Operating temperature
Physical and mechanical properties
SiCp/Al composites
Surface metallization
Dielectric properties of graphene-filled epoxy nanocomposite with enhanced thermal conductivity
会议论文
作者:
Li, He
;
Tian, Huidong
;
Cai, Mengchu
;
Gong, Ao
;
Zhou, Ziyu
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/11/26
Advanced dielectric materials
Application of polymers
Electronic Packaging
Enhanced thermal conductivity
Epoxy nanocomposites
Graphene nanosheets
High thermal conductivity
Thermo-gravimetric properties
Preparation and characterization of chitosan film incorporated with thinned young apple polyphenols as an active packaging material
期刊论文
CARBOHYDRATE POLYMERS, 2017, 卷号: 163, 页码: 81-91
作者:
Sun, Lijun
;
Sun, Jiaojiao
;
Chen, Lei
;
Niu, Pengfei
;
Yang, Xingbin
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/26
Film characterization
Young apple polyphenols
Chitosan film
Film bioactivities
Packaging material
Performance of a 1.2kV, 288A Full-SiC MOSFET Module based on Low Inductance Packaging Layout
会议论文
作者:
Qiao, Liang
;
Yang, Xu
;
Ren, Yu
;
Zhang, Fan
;
Wang, Laili
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/26
Silicon Carbide
module packaging
MOSFET
commutation loop inductance
split damping capacitor
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