QQ客服 官方微博 反馈留言

浏览/检索结果: 共11条，第1-10条 帮助 限定条件 专题：武汉大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure 期刊论文 IEEE TRANSACTIONS ON POWER ELECTRONICS, 2017, 卷号: 32, 期号: 7 作者:  Lei, Xiang;  Zheng, Huai;  Guo, Xing;  Zhang, Zefeng;  Wu, Jiading 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/05 Boron nitride (BN)/silicone  die-bonding interface  embedding packaging structure  light-emitting diodes (LEDs)  thermal resistance   Novel fabrication method of LED freeform lens based on electrohydrodynamic 会议论文 作者:  Zhao, Zhili;  Zheng, Huai;  Liu, Sheng;  Guo, Xing;  Zhang, Zefeng 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/05 LEDs  electrohydrodynamic processing method  light uniformity  freeform lens   Enhanced thermal conductivity of QDs-polymer film for light-emitting diodes via electrospinning 会议论文 作者:  Lei, Xiang;  Zheng, Huai;  Guo, Xing;  Zhang, Zefeng;  Wu, Jiading 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/05 quantum dots  LEDs  electrospinning  thermal conductivity   Fabrication of Microlens Array Encapsulation Layer based on porous film by breath figure method for Chip-On-Board light-emitting diodes 会议论文 作者:  Zhang, Zefeng;  Guo, Xing;  Lei, Xiang;  Wu, Jiading;  Xu, Chunlin 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05 light-emitting diodes  porous film fabrication  microlens array  light extraction efficiency (LEE)   Fabrication of microlens array encapsulation layer based on porous film by breath figure method for chip-on-board light-emitting diodes 会议论文 作者:  Zhang, Zefeng;  Guo, Xing;  Lei, Xiang;  Wu, Jiading;  Xu, Chunlin 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05 Fabrication of Freeform Lens Based on Ionic Wind for Chip-on-Board Light-Emitting Diodes 会议论文 作者:  Zhang, Zefeng;  Wu, Jiading;  Guo, Xing;  Lei, Xiang;  Liu, Sheng 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05 Fabrication of microlens array encapsulation layer based on porous film by breath figure method for chip-on-board light-emitting diodes 期刊论文 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, 2016 作者:  Zheng, Huai;  Xu, Chunlin;  Liu, Sheng;  Wu, Jiading;  Guo, Xing 收藏  |  浏览/下载：17/0  |  提交时间：2019/12/05 Enhanced thermal conductivity of QDs-polymer film for light-emitting diodes via electrospinning 期刊论文 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, 2016 作者:  Guo, Xing;  Zheng, Huai;  Lei, Xiang;  Liu, Sheng;  Xu, Chunlin 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05 Novel fabrication method of LED freeform lens based on electrohydrodynamic 期刊论文 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, 2016 作者:  Chu, Jinchao;  Guo, Xing;  Liu, Sheng;  Zhao, Zhili;  Zheng, Huai 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05 Fabrication of freeform lens based on ionic wind for Chip-on-Board light-emitting diodes 会议论文 作者:  Lei, Xiang;  Wu, Jiading;  Zhang, Zefeng;  Zheng, Huai;  Liu, Sheng 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/05 light-emitting diodes (LEDs)  ionic wind  lens fabrication  light intensity distributions (LIDs)