QQ客服 官方微博 反馈留言

	Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure
	Lei, Xiang; Zheng, Huai; Guo, Xing; Zhang, Zefeng; Wu, Jiading; Xu, Chunlin; Liu, Sheng
刊名	IEEE TRANSACTIONS ON POWER ELECTRONICS
	2017
卷号	32期号:7
关键词	Boron nitride (BN)/silicone die-bonding interface embedding packaging structure light-emitting diodes (LEDs) thermal resistance
ISSN号	0885-8993
DOI	10.1109/TPEL.2016.2609891
URL标识	查看原文
收录类别	SCIE ; EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4090343
专题	武汉大学
推荐引用方式 GB/T 7714	Lei, Xiang,Zheng, Huai,Guo, Xing,et al. Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure[J]. IEEE TRANSACTIONS ON POWER ELECTRONICS,2017,32(7).
APA	Lei, Xiang.,Zheng, Huai.,Guo, Xing.,Zhang, Zefeng.,Wu, Jiading.,...&Liu, Sheng.(2017).Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure.IEEE TRANSACTIONS ON POWER ELECTRONICS,32(7).
MLA	Lei, Xiang,et al."Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure".IEEE TRANSACTIONS ON POWER ELECTRONICS 32.7(2017).

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。