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CORC

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Gaussian process regression for prediction of sulfate content in lakes of China 期刊论文
Journal of Engineering and Technological Sciences, 2019, 卷号: 51, 页码: 198-215
作者:  Zhao, Jinginy;  Guo, Hai;  Han, Min;  Tang, Haoran;  Li, Xiaoniu
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016) 期刊论文
MATERIALS LETTERS, 2018, 卷号: 230, 页码: 76-76
作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy 期刊论文
MICROELECTRONICS RELIABILITY, 2018, 卷号: 83, 页码: 198-205
作者:  Ma, Haoran;  Kunwar, Anil;  Chen, Jun;  Qu, Lin;  Wang, Yunpeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 4383-4390
作者:  Ma, Haoran;  Kunwar, Anil;  Liu, Zhiyuan;  Chen, Jun;  Wang, Yunpeng
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 602-613
作者:  Ma, Haitao;  Ma, Haoran;  Kunwar, Anil;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and IMCs during multiple reflows 期刊论文
VACUUM, 2017, 卷号: 145, 页码: 103-111
作者:  Ma, Haoran;  Wang, Yunpeng;  Chen, Jun;  Kunwar, Anil;  Ma, Haitao
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows 期刊论文
INTERMETALLICS, 2017, 卷号: 90, 页码: 90-96
作者:  Ma, Haoran;  Kunwar, Anil;  Huang, Ru;  Chen, Jun;  Wang, Yunpeng
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 页码: 7699-7706
作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Guo, Bingfeng;  Meng, Zhixian
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient 期刊论文
MATERIALS LETTERS, 2016, 卷号: 172, 页码: 211-215
作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints 期刊论文
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2016, 卷号: 122
作者:  Ma, Haoran;  Kunwar, Anil;  Guo, Bingfeng;  Sun, Junhao;  Jiang, Chengrong
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09

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