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	Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy
	Ma, Haoran; Kunwar, Anil; Chen, Jun; Qu, Lin; Wang, Yunpeng; Song, Xueguan; Raback, Peter; Ma, Haitao; Zhao, Ning
刊名	MICROELECTRONICS RELIABILITY
	2018
卷号	83页码:198-205
关键词	Electronic packaging Zinc Tin Finite element method SEM Nemst-Planck equation
ISSN号	0026-2714
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3263919
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Peoples R China. 3.CSC IT Ctr Sci, Keilaranta 14,POB 405, FIN-02101 Espoo, Finland.
推荐引用方式 GB/T 7714	Ma, Haoran,Kunwar, Anil,Chen, Jun,et al. Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J]. MICROELECTRONICS RELIABILITY,2018,83:198-205.
APA	Ma, Haoran.,Kunwar, Anil.,Chen, Jun.,Qu, Lin.,Wang, Yunpeng.,...&Zhao, Ning.(2018).Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy.MICROELECTRONICS RELIABILITY,83,198-205.
MLA	Ma, Haoran,et al."Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy".MICROELECTRONICS RELIABILITY 83(2018):198-205.

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