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CORC

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Micromachined Cavity-based Bandpass Filter and Suspended Planar Slow-wave Structure for Vacuum-microelectronic Millimeter-wave/THz Microsystem Embedded in LTCC Packaging Substrates 其他
2015-01-01
Miao, Min; Fang, Runiu; Zhang, Xiaoqing; Ning, Biao; Mu, Fangqing; Li, Zhensong; Xiang, Wei; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
DESIGN  
Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform 其他
2013-01-01
Miao, Min; Jin, Yufeng; Fang, Runiu; Mu, Fangqing; Guo, Shichao; Zhang, Xiaoqing; Zhang, Yang; Hu, Duwei; Li, Zhensong; Xiang, Wei
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/17
Investigation of a Unified LTCC-based Micromachining and Packaging Platform for High Density/Multifunctional Microsystem Integration 其他
2012-01-01
Miao, Min; Jin, Yufeng; Gan, Hua; Zhang, Jing; Qiu, Yunsong; Zhang, Yang; Zhang, Yangfei; Cao, Rui; Li, Zhensong; Wang, Zhengyi; Mu, Fangqing; Gao, Chengchen
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16
Fabrication of Ultra-thin Silicon PIN Detector 其他
2011-01-01
Yu, Min; Dong, Xianshan; Li, Ying; Tian, Dayu; Wang, Jinyan; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13
Fabrication and characterization of ultra-thin PIN detector 其他
2010-01-01
Li, Ying; Ma, Shenglin; Jin, Yufeng; Yu, Min; Zhang, Lu; Wang, Jinyan
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/13
3D modeling and finite-element full-wave simulation of TSV for stack up SIP integration applications 其他
2010-01-01
Miao, Min; Liang, Lei; Li, Zhensong; Han, Bo; Sun, Xin; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13
A Research on Thick PIN Detector with High Breakdown Voltage 其他
2010-01-01
Wu, Dongmei; Yu, Min; Ma, Shenglin; Zhang, Lu; Wei, Chunxi; Zhang, Xiaohang; Li, Qiang; Li, Guanhuang; Wang, Haomin; Wang, Jinyan; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13
A vacuum/airtight package with multifunctional LTCC substrate and integrated Pirani vacuum gauge for 3D SIP integration applications 其他
2010-01-01
Miao, Min; Gan, Hua; Jin, Yufeng; Li, Zhensong
收藏  |  浏览/下载：7/0  |  提交时间：2015/11/13
An online monitoring approach for Web service requirements 其他
2009-01-01
Wang, Qianxiang; Shao, Jin; Deng, Fang; Liu, Yonggang; Li, Min; Han, Jun; Mei, Hong
收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03
Microfabrication of Through Silicon Vias (TSV) for 3D SiP 其他
2008-01-01
Liao, Hongguang; Miao, Min; Wan, Xin; Jin, Yufeng; Zhao, Liwei; Li, Bohan; Zhu, Yuhui; Sun, Xin
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/12

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