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CORC

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MORPHOLOGY CONTROL OF MICROCHANNEL CROSS-SECTION USING SACRIFICIAL SPINNING FIBER 其他
2017-01-01
Zhang, Yangxi; Jing, Huize; Xu, Kaisi; Gao, Chencheng; Hao, Yilong; Meng, Fanrui; Gui, Yiming; Chen, Guoxing
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Band-wise Adaptive Sparsity Regularization for Quantized Compressed Sensing Exploiting Nonlocal Similarity 其他
2017-01-01
Mu, Jing; Xiong, Ruiqin; Zhang, Xinfeng; Ma, Siwei
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Adaptive multi-dimension sparsity based coefficient estimation for compression artifact reduction 其他
2016-01-01
Mu, Jing; Zhang, Xinfeng; Xiong, Ruiqin; Ma, Siwei; Gao, Wen
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
ADAPTIVE MULTI-DIMENSION SPARSITY BASED COEFFICIENT ESTIMATION FOR COMPRESSION ARTIFACT REDUCTION 其他
2016-01-01
Mu, Jing; Zhang, Xinfeng; Xiong, Ruiqin; Ma, Siwei; Gao, Wen
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Process Development of Through-Glass-Via (TGV) Interposer for Radio Frequency (RF) Applications 其他
2016-01-01
Yan, Jun; Ma, Shenglin; Ma, Feilong; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Compression Artifact Reduction for Low Bit-Rate Images Based on Non-Local Similarity and Across-Resolution Coherence 其他
2015-01-01
Mu, Jing; Xiong, Ruiqin; Fan, Xiaopeng; Ma, Siwei
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Quality Evaluation and Simulation of Through-Multilayer TSV Integration Process for Memory Stacking 其他
2015-01-01
Guan, Yang; Zeng, Qinghua; Chen, Jing; Jin, Yufeng; Ma, Shenglin
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Studies on fully transparent Al-Sn-Zn-O thin-film transistors fabricated on glass at low temperature 其他
2015-01-01
Cong, Yingying; Han, Dedong; Wu, Jing; Zhao, Nannan; Chen, Zhuofa; Zhao, Feilong; Dong, Junchen; Zhang, Shengdong; Zhang, Xing; Wang, Yi
收藏  |  浏览/下载：1/0  |  提交时间：2017/12/04
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03

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