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浏览/检索结果: 共13条，第1-10条 帮助 限定条件 内容类型：其他    专题：北京大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng 收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation  THROUGH-SILICON VIAS  STACKING TECHNOLOGY  LINER   Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他 2015-01-01 Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 INTERPOSER  STACKING   Electrical measurement and analysis of TSV/RDL for 3D integration 其他 2014-01-01 Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17 A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他 2014-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 INTERCONNECTS   Development and Characterization of a Through-Multilayer TSV Integrated SRAM Module 其他 2013-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：8/0  |  提交时间：2015/11/16 Chemical-Mechanical Polishing of Bulk Tungsten Substrate 其他 2013-01-01 Luo, Jin; Zhang, Yiming; Song, Lu; Chen, Shuhui; Bian, Yuan; Li, Tianyu; Hao, Yilong; Chen, Jing 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16 CMP  tungsten  average surface roughness  the platen rotational speed   GAMLL: Gateway Assisted Multicast Algorithm towards Low Latency for Wireless Mesh Networks 其他 2013-01-01 Yuan, Yuan; Bian, Chaoyi; Zhao, Tong; Yan, Wei 收藏  |  浏览/下载：7/0  |  提交时间：2015/11/16 ROUTING PROTOCOL   A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他 2012-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via 其他 2012-01-01 Miao, Min; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Fang, Runiu; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Parametric Study, Modeling of Etching Process and Application for Tapered Through-Silicon-Via 其他 2012-01-01 Ma, Shenglin; Zhong, Xiao; Bian, Yuan; Sun, Xin; Zhu, Yunhui; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16