CORC

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Research on Improvement of TiAlN Coating on Tribological properties of Miniature Inner Grooved Copper Tubes Drawing Mold Materials (CPCI-S收录) 会议
作者:  Ma, Bo[1];  Liu, Bin[1];  Yuan, Wei[1];  Li, Zongtao[1];  Li, Fuqiu[2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Comparative study of S, Fe and Cu speciation transformation during. chalcopyrite bioleaching by mixed mesophiles and mixed thermophiles (CPCI-S收录) 会议
作者:  Liu, Hong-chang[1,4];  Xia, Jin-lan[1,2];  Nie, Zhen-yuan[1,2];  Liu, Li-zhu[1];  Wang, Lei[1]
收藏  |  浏览/下载:7/0  |  提交时间:2019/04/11
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package (CPCI-S收录) 会议
作者:  Luo, Rongfeng[1];  Ren, Kuili[1];  Ma, Shenglin[1];  Yan, Jun[1];  Xia, Yanming[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录) 会议
作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Bian, Yuan[1];  Zhong, Xiao[1];  Chen, Jing[1]
收藏  |  浏览/下载:8/0  |  提交时间:2019/04/11
Activation of FAK Promotes IHRK-Mediated Osteogenesis for Tensile Force-Subjected Periodontal Ligament Cell (CPCI-S收录) 会议
作者:  Li, Ze-jian[1];  Lu, Chun-ting[1];  Ma, Shu-yuan[1];  Lai, Ren-fa[1,2];  Li, Jiong[2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Cultivation of Periodontal Tissue Cell Sheet by a New Way for Cell Sheet Engineering (CPCI-S收录) 会议
作者:  Li, Ze-jian[1];  Lu, Chun-ting[1];  Ma, Shu-yuan[1];  Lai, Ren-fa[1,2];  Li, Jiong[2]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/11
Study on Dowel Bar Length and Spacing Based on Theoretical Computation (CPCI-S收录) 会议
作者:  Hu, Chichun[1];  Ma, Jiexian[1];  Yu, Yuan[1];  Luo, Yi[1];  Phimmatat, Sayvichit[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Teachers' influence on glasses purchase and wear in China: the PRICE (Potentiating Rural Investment in Children's Eyecare) study (CPCI-S收录) 会议
作者:  Wang, Xiuqin[1,2];  Ma, Yue[3];  Zhou, Yuan[4];  Jin, Ling[1];  Xiao, Baixiang[1]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/11
Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录) 会议
作者:  Lin, Yuan-Jiang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling (CPCI-S收录) 会议
作者:  Guan, Yong[1];  Zhu, Yunhui[1];  Zeng, Qinghua[1];  Ma, Shenglin[1,2];  Su, Fei[3]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11


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