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华南理工大学 [20]
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会议 [20]
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Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录)
会议
作者:
Liang, Shui-Bao[1]
;
Ke, Chang-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
microvoids
solder interconnect
electrical field
phase field simulation
A Dual-Polarized Base-Station Antenna For LTE Communication System (CPCI-S收录)
会议
作者:
Guo, Xing-Xin[1]
;
Wen, Ding-Liang[1]
;
Chu, Qing-Xin[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
dual-polarized antenna
wideband antenna
base-station antenna
LTE
A Broadband Dual-Polarized Antenna With Gamma-Shaped Feeding Structures (CPCI-S收录)
会议
作者:
Wen, Ding-Liang[1]
;
Chu, Qing-Xin[1]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
dual-polarized antenna
broadband antenna
stable radiation pattern
Gamma-shaped feeds
Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录)
会议
作者:
Ma, Wen-Jing[1]
;
Ke, Chang-Bo[1]
;
Liang, Shui-bao[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/11
Kirkendall void
growth exponent
morphological evolution
cyclic loading
phase field cystal model
Three principles of designing base-station antennas (EI收录)
会议
Hobart, TAS, Australia,
作者:
Chu, Qing-Xin[1]
;
Luo, Yu[1]
;
Wen, Ding-Liang[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Base stations
Frequency bands
Impedance matching (electric)
Polarization
One-pot synthesis of ordered mesoporous Cu-KIT-6 and its improved catalytic behavior for the epoxidation of styrene: Effects of the pH value (CPCI-S收录)
会议
作者:
Li, Baitao[1]
;
Luo, Xin[1]
;
Huang, Jing[1]
;
Wang, Xiujun[1]
;
Liang, Zhenxing[1]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Mesoporous material
KIT-6
Styrene epoxidation
pH-adjusting
Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录)
会议
作者:
Liang, Shui-Bao[1]
;
Ke, Chang-Bo[1]
;
Ma, Wen-Jing[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
segregation
electromigration
Sn-Bi solder
interconnect
phase field simulation
Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录)
会议
作者:
Jiang, Han[1]
;
Liang, Shui-Bao[1]
;
Yuwen, Hui-Hui[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
TSV
solder bump joint
thermal fatigue
size effect
finite element analysis
Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al (CPCI-S收录)
会议
作者:
Chen, Guo-Liang[1,2]
;
Zhou, Min-Bo[1,2]
;
Zhang, Lang[1,2]
;
Lin, Yuan-Jiang[1,2]
;
Zhang, Yu-Peng[3]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
aluminum soldering
Sn-0.7Cu solder
interfacial microstructure
mechanical property
LED assembly
Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interc (CPCI-S收录)
会议
作者:
Liang, Shui-Bao
;
Ke, Chang-Bo
;
Tan, Meng-Ying
;
Zhou, Min-Bo
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
electromigration
microstructure evolution
phase segregation
Cu/Sn-Bi/Cu interconnect
phase field simulation
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