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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Differential expression of the Wnt/β-catenin pathway in the genital tubercle (GT) of fetal male rat following maternal exposure to di-n-butylphthalate (DBP) 会议论文 GTAUF2014 & APSMHA2014第六届长城泌尿男科转化医学论坛暨第七届亚太男性健康与抗衰老研究学会年会论文集中国医师协会;中国医疗保健国际交流促进会 作者:  Li-Feng Zhang[1];  Chao Qin[2];  Yun-Fei Wei[3];  Yong Wang[4];  Jun-Kai Chang[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/23 Di-n-butyl phthalate (DBP) Wnt/β-catenin pathway genital tubercle (GT)   Face recognition using nonlinear partial least squares in reproducing kernel Hilbert space (EI收录) 会议论文 Communications in Computer and Information Science, Beijing, China, September 24, 2012 - September 26, 2012 作者:  Hu, Ye-Gang[1];  Ren, Chuan-Xian[2];  Yao, Yun-Fei[1];  Li, Wan-Yi[3];  Feng-Wang[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/15 Covariance matrix  Damping  Feature extraction  Iterative methods   Ductile-to-brittle transition of flip-chip solder joints influenced by electromigration (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Lu, Yu-Dong[1,2];  En, Yun-Fei[1,2];  He, Xiao-Qi[1,2];  Niu, Gang[3];  Pecht, Michael[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Aluminum  Chip scale packages  Ductile fracture  Ductility  Electromigration  Flip chip devices  Intermetallics  Mechanical properties  Packaging  Vacancies   Mechanical properties of flip-chip solder joints effected by Electromigration (EI收录) 会议论文 Advanced Materials Research, Guilin, China, April 9, 2011 - April 11, 2011 作者:  Lu, Yu Dong[1,2];  En, Yun Fei[1];  Wan, Ming[1,2];  He, Xiao Qi[1];  Wang, Xin[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Aluminum  Ductile fracture  Ductility  Electromigration  Flip chip devices  Intermetallics  Manufacture  Mechanical properties  Soldering alloys  Vacancies   Failure modes of Sn3.0Ag0.5Cu Flip-chip Solder Joints under Current Stress (EI收录) 会议论文 Proceedings of 2009 8th International Conference on Reliability, Maintainability and Safety, ICRMS 2009, Chengdu, China, July 20, 2009 - July 24, 2009 作者:  Lu, Yu-Dong[1,2];  He, Xiao-Qi[2];  En, Yun-Fei[2];  Wang, Xin[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/17 Electromigration  Flip chip devices  Maintainability  Reliability analysis   Failure mechanism of Sn3.0Ag0.5Cu flip-chip solder joints under electric current stress (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 6, 2009 - July 10, 2009 作者:  Lu, Yu-Dong[1,2,3];  He, Xiao-Qi[1,2];  En, Yun-Fei[1,2];  Wang, Xin[3] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Electromigration  Flip chip devices  Integrated circuits  Quality assurance  Safety factor   Failure Modes of Sn3.0Ag0.5Cu Flip-chip Solder Joints under Current Stress (CPCI-S收录) 会议论文 PROCEEDINGS OF 2009 8TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY, VOLS I AND II: HIGHLY RELIABLE, EASY TO MAINTAIN AND READY TO SUPPORT 作者:  Lu, Yu-Dong[1];  He, Xiao-Qi[2];  En, Yun-Fei[2];  Wang, Xin[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Sn3.0Ag0.5Cu  flip chip  solder joint  electromigration   Studies on antivirus effects of polysaccharides from Sargassum fusiforme in vitro 会议论文 湖北宜昌, 2004年05月28日 作者:  CEN Ying-zhou [1];  KHOO Gaik-ming [1];  XU Shao-yu [1];  WANG Ling-yun [2];  ZHANG Mei-ying [3] 收藏  |  浏览/下载：12/0  |  提交时间：2019/12/13 羊栖菜  多糖  单纯疱疹病毒  柯萨奇病毒  抗病毒药物