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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 New Approach of Establishing a Cloud Service Center to Protect Comprehensive Emergency Management Information Systems (CPCI-S收录) 会议论文 INTERNATIONAL CONFERENCE ON ARTIFICIAL INTELLIGENCE AND SOFTWARE ENGINEERING (AISE 2014) 作者:  Wang, Fei[1];  Zhong, Shao-bo[2];  Zheng, Xiao-cui[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 Cloud computing  Cloud service center  Emergency management information system   Effect of Activators and Surfactants in Halogen-free Fluxes on Wettability of Sn-0.7Cu-0.05Ni Solder on Cu Substrate (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Li, Chang-Zheng[1];  Yan, Mo-Yang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 activator  surfactant  wettability  halogen-free flux  Sn-0.7Cu-0.05Ni solder   Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Li, Chang-Zheng[1];  Yan, Mo-Yang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Electronics packaging  Nickel  Soldering  Soldering alloys  Substrates  Surface active agents  Wetting   Processing Performance and Microstructure of Sn-Zn Based Solders Modified by Bi and Mixed Rare Earth Elements (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Chang-Zheng[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Dataflow Driven Hardware Description Method and Its Circuit Synthesis Based on Operators (CPCI-S收录) 会议论文 2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012) 作者:  Yong, Shan-Shan[1];  Wang, Xin-An[1];  Lan, Jing[1];  Wu, Cheng-Hao[1];  Long, Xiao-Bo[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Chang-Zheng[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Differential scanning calorimetry  Electronics packaging  Melting point  Microstructural evolution  Soldering  Soldering alloys  Wetting  Zinc   Some recent works on head-related transfer functions and virtual auditory display in China (EI收录) 会议论文 Proceedings of the AES International Conference, Tokyo, Japan, October 8, 2010 - October 10, 2010 作者:  Xie, Bo-Sun[1];  Zhong, Xiao-Li[1];  Yu, Guang-Zheng[1];  Guan, Shan-Qun[2];  Rao, Dan[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Audio acoustics  Audition  Signal processing