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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Monitoring Salinity-corelative River Water Color by Field Spectrum Associated Hyperion image in Pearl River Estuary (CPCI-S收录) 会议论文 2006 IEEE INTERNATIONAL GEOSCIENCE AND REMOTE SENSING SYMPOSIUM, VOLS 1-8 作者:  Chen, Shui-sen[1,2];  Zeng, Yu-huai[2];  Fang, Li-gang[2,4];  Zhang, Li-xin[1];  Tang, Xiaoling[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/18 Pearl River estuary  river water color  Hyperion data  suspended solid  monitoring   Undercooling and Solidification Behavior of Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/UBM Joints (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Xu, Guang-Sui[1];  Zeng, Jing-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 undercooling  solidification  cooling rate  Sn-Ag-Cu solder ball  Cu/Ni UBM   Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints (CPCI-S收录EI收录) 会议论文 14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, Hong kong, December 13, 2012 - December 16, 2012 作者:  Zeng, Jing-Bo[1];  Xu, Guang-Sui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/15 Brittle fracture  Brittleness  Failure modes  Morphology  Nickel  Tensile strength   Microstructural Evolution and Mechanical Behavior of Line-type Ni/Sn3.0Ag0.5Cu/Ni Interconnects with a Small Thickness during Isothermal Agin (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Zeng, Jing-Bo[1];  Xu, Guang-Sui[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during Liquid Isothermal Aging at and above the Solder's Melting Tem (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Zhou, Min-Bo[1];  Zeng, Jing-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Undercooling and solidification behavior of Sn-Ag-Cu solder balls and Sn-Ag-Cu/UBM joints (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Xu, Guang-Sui[1];  Zeng, Jing-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/15 Cooling  Electronics packaging  Silver  Soldering  Soldering alloys  Solidification  Undercooling   Influence of Soldering Temperature and Dwelling Time on Morphological Evolution of CU6Sn5 Intermetallic Compound at the Sn-3.0Ag-0.5Cu/Cu Int (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Xu, Guang-Sui[1];  Zeng, Jing-Bo[1];  Zhou, Min-Bo[1];  Cao, Shan-Shan[1];  Ma, Xiao[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Influence of soldering temperature and dwelling time on morphological evolution of Cu6Sn5 intermetallic compound at the Sn-3.0Ag-0.5Cu/Cu int (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Xu, Guang-Sui[1];  Zeng, Jing-Bo[1];  Zhou, Min-Bo[1];  Cao, Shan-Shan[1];  Ma, Xiao[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/15 Electronics packaging  Housing  Soldering alloys  Tin   Isothermal Aging Effect on Microstructure and Mechanical Properties of Ni/Sn3.0Ag0.5Cu/Ni Interconnects with the Decreasing Height (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Zeng, Jing-Bo[1];  Xu, Guang-Sui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Lead-free solder micro-interconnect  Intermetallic compound  Solder joint height  Tensile fracture behavior   Influence of different buffer layer on intense pulsed field emission of carbon nanotubes (EI收录) 会议论文 Advanced Materials Research, Taipei, Taiwan, October 17, 2012 - October 18, 2012 作者:  Ma, Hua-Li[1];  Zhang, Xin-Yue[1];  Qiao, Shu-Zhen[1];  Zhang, Rui[1];  Zeng, Fan-Guang[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/15 Carbon nanotubes  Electric fields  Electroless plating  Field emission  Field emission microscopes  Gold alloys  Information technology  Silicon