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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The real-time fault diagnosis of electrolytic filter capacitors in switching mode power supply (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013 作者:  Shi, Zheng-Yu[1];  Lu, Yu-Dong[1];  Tao, Ning[1,2];  Li, Meng-Qi[1,3];  Feng, Jing-Dong[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Failure analysis  Integrated circuits  Power supply circuits  Principal component analysis  Shape memory effect   The spatial polymorphism compound of the under-eave space in the traditional commercial towns in the west of hunan province (EI收录) 会议论文 Applied Mechanics and Materials, Zhangjiajie, China, August 10, 2012 - August 12, 2012 作者:  Yu, Hanwu[1,2];  Lu, Qi[3] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Fluid mechanics  Shore protection  Sustainable development   The Spatial Polymorphism Compound of the Under-eave Space in the Traditional Commercial towns in the West of Hunan Province (CPCI-S收录) 会议论文 SUSTAINABLE CITIES DEVELOPMENT AND ENVIRONMENT, PTS 1-3 作者:  Yu, Hanwu[1];  Lu, Qi[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 The traditional Commercial town  The under-eave space  Polymorphism  Faintness   Ductile-to-brittle transition of flip-chip solder joints influenced by electromigration (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Lu, Yu-Dong[1,2];  En, Yun-Fei[1,2];  He, Xiao-Qi[1,2];  Niu, Gang[3];  Pecht, Michael[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Aluminum  Chip scale packages  Ductile fracture  Ductility  Electromigration  Flip chip devices  Intermetallics  Mechanical properties  Packaging  Vacancies   Mechanical properties of flip-chip solder joints effected by Electromigration (EI收录) 会议论文 Advanced Materials Research, Guilin, China, April 9, 2011 - April 11, 2011 作者:  Lu, Yu Dong[1,2];  En, Yun Fei[1];  Wan, Ming[1,2];  He, Xiao Qi[1];  Wang, Xin[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Aluminum  Ductile fracture  Ductility  Electromigration  Flip chip devices  Intermetallics  Manufacture  Mechanical properties  Soldering alloys  Vacancies   Failure modes of Sn3.0Ag0.5Cu Flip-chip Solder Joints under Current Stress (EI收录) 会议论文 Proceedings of 2009 8th International Conference on Reliability, Maintainability and Safety, ICRMS 2009, Chengdu, China, July 20, 2009 - July 24, 2009 作者:  Lu, Yu-Dong[1,2];  He, Xiao-Qi[2];  En, Yun-Fei[2];  Wang, Xin[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/17 Electromigration  Flip chip devices  Maintainability  Reliability analysis   Failure mechanism of Sn3.0Ag0.5Cu flip-chip solder joints under electric current stress (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 6, 2009 - July 10, 2009 作者:  Lu, Yu-Dong[1,2,3];  He, Xiao-Qi[1,2];  En, Yun-Fei[1,2];  Wang, Xin[3] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Electromigration  Flip chip devices  Integrated circuits  Quality assurance  Safety factor   Failure Modes of Sn3.0Ag0.5Cu Flip-chip Solder Joints under Current Stress (CPCI-S收录) 会议论文 PROCEEDINGS OF 2009 8TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY, VOLS I AND II: HIGHLY RELIABLE, EASY TO MAINTAIN AND READY TO SUPPORT 作者:  Lu, Yu-Dong[1];  He, Xiao-Qi[2];  En, Yun-Fei[2];  Wang, Xin[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Sn3.0Ag0.5Cu  flip chip  solder joint  electromigration