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The sixth visual object tracking VOT2018 challenge results 会议论文
15th European Conference on Computer Vision, ECCV 2018, Munich, Germany, 2018-09-08
作者:  Kristan, Matej;  Leonardis, Ale;  Matas, Jií;  Felsberg, Michael;  Pflugfelder, Roman
收藏  |  浏览/下载：140/0  |  提交时间：2019/12/02
A Weight-based Approach to Combinatorial Test Generation 会议论文
PROCEEDINGS 2018 IEEE/ACM 40TH INTERNATIONAL CONFERENCE ON SOFTWARE ENGINEERING - COMPANION (ICSE-COMPANION, 2018-01-01
作者:  Zhao, Jing;  Ning, G. R.;  Lu, H. L.;  Wang, Y. B.;  Cai, Yan
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Online Data Segmentation Based on Clustering Algorithm and Autoregressive Model for Human Actions Recognition 会议论文
2017 4TH INTERNATIONAL CONFERENCE ON INFORMATION, CYBERNETICS AND COMPUTATIONAL SOCIAL SYSTEMS (ICCSS), 2017-01-01
作者:  Jiang, M.;  Liu, X. L.;  Zhang, Z.;  Zhao, Y.;  Zhang, R.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Stopping and charge state revolution of low-energy ion beam in plasma 会议论文
XXX INTERNATIONAL CONFERENCE ON PHOTONIC, ELECTRONIC, AND ATOMIC COLLISIONS (ICPEAC2017), 2017-01-01
作者:  Zhao, Y.;  Cheng, R.;  Zhou, X.;  Wang, Y.;  Lei, Y.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/03
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Wang, Y. P.;  Chen, J.;  Ma, H. T.;  Zhao, N.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Li, S.;  Yao, M. J.;  Wang, Y. P.;  Chen, J.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Ma, H.R.;  Li, S.;  Yao, M.J.;  Wang, Y.P.;  Chen, J.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The Visual Object Tracking VOT2016 Challenge Results 会议论文
14th European Conference on Computer Vision (ECCV), Amsterdam, NETHERLANDS
作者:  Kristan, Matej;  Leonardis, Ales;  Matas, Jiri;  Felsberg, Michael;  Pflugfelder, Roman
收藏  |  浏览/下载：24/0  |  提交时间：2019/12/09
Polymer Microring Resonators for Biosensing Applications by Nanoimprint Lithography 会议论文
17th International Conference on Transparent Optical Networks (ICTON 2015), Budapest, HUNGARY, 2015-07-05
作者:  Morarescu, R.;  Pal, P. K.;  Han, X.;  Zhao, M.;  Bienstman, P.
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/09

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