| The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows | |
| Ma, H. R.; Wang, Y. P.; Chen, J.; Ma, H. T.; Zhao, N. | |
| 2017 | |
| 会议名称 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2017-01-01 |
| 关键词 | multiple reflow interface intermetallic compounds growth kinetics temperature |
| 页码 | 1402-1405 |
| 会议录 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3300526 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Ma, H. R.,Wang, Y. P.,Chen, J.,et al. The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows[C]. 见:2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2017-01-01. |
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