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CORC

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Oxidation Kinetics Researches under the Condition of Compressive Loading 会议论文
2018 2ND INTERNATIONAL CONFERENCE ON ADVANCED TECHNOLOGIES IN MANUFACTURING AND MATERIALS ENGINEERING (ATMME 2018), 2018-01-01
作者:  Zhou, C. H.;  Pan, R. Y.;  Ma, H. T.;  Zhang, H.;  Guan, X. G.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Wang, Y. P.;  Chen, J.;  Ma, H. T.;  Zhao, N.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Li, S.;  Yao, M. J.;  Wang, Y. P.;  Chen, J.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
The precision measurement and assembly for miniature parts based on double machine vision systems 会议论文
9th International Symposium on Precision Engineering Measurements and Instrumentation (ISPEMI), Changsha, PEOPLES R CHINA, 2014-08-08
作者:  Wang, X. D.;  Zhang, L. F.;  Xin, M. Z.;  Qu, Y. Q.;  Luo, Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Prediction of inner aircraft surface temperature based on the onboard and the outboard coupling 会议论文
13th International Conference on Indoor Air Quality and Climate, Indoor Air 2014, 2014-07-07
作者:  Ma P.;  Zhang T.;  Wang S.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Dye-sensitized solar cells from fundamental research to application 会议论文
Advanced Optoelectronics for Energy and Environment, AOEE 2013, Wuhan, 2013-05-25
作者:  Ma T.;  Shi Y.;  Wang L.;  Zhou H.;  Guo J.
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13
In-situ study on the formation and evolution behavior of voids at the interface during soldering process by synchrotron radiation real-time imaging technology 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  Qu, L.;  Zhao, H. J.;  Wang, J.;  Gu, L. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13
Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  An, L. L.;  Qu, L.;  Wang, J.;  Gu, L. Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/13

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