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Reaction-Induced Strong Metal-Support Interactions between Metals and Inert Boron Nitride Nanosheets 期刊论文
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2020, 卷号: 142, 期号: 40, 页码: 17167-17174
作者:  Dong, Jinhu;  Fu, Qiang;  Li, Haobo;  Xiao, Jianping;  Yang, Bing
收藏  |  浏览/下载:17/0  |  提交时间:2021/02/02
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin
收藏  |  浏览/下载:70/0  |  提交时间:2021/02/02
The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
作者:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan
收藏  |  浏览/下载:15/0  |  提交时间:2021/02/02
Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters 期刊论文
JOURNAL OF MICROSCOPY, 2020, 卷号: 279, 期号: 3, 页码: 212-216
作者:  Robertson, Stuart;  Doak, Scott;  Sun, Fu-Long;  Liu, Zhi-Quan;  Liu, Changqing
收藏  |  浏览/下载:28/0  |  提交时间:2021/02/02
Room temperature ferromagnetism in ultra-thin van der Waals crystals of 1T-CrTe2 期刊论文
NANO RESEARCH, 2020, 页码: 6
作者:  Sun, Xingdan;  Li, Wanying;  Wang, Xiao;  Sui, Qi;  Zhang, Tongyao
收藏  |  浏览/下载:49/0  |  提交时间:2021/02/02
Preparation of alumina/aluminide coatings on molybdenum metal substrates, and protection performance evaluation utilizing a DZ40M superalloy casting test 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2020, 卷号: 395, 页码: 15
作者:  Zheng, Liwei;  Liu, Enze;  Zheng, Zhi;  Ning, Likui;  Tong, Jian
收藏  |  浏览/下载:14/0  |  提交时间:2021/02/02
Preparation of alumina/aluminide coatings on molybdenum metal substrates, and protection performance evaluation utilizing a DZ40M superalloy casting test 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2020, 卷号: 395, 页码: 15
作者:  Zheng, Liwei;  Liu, Enze;  Zheng, Zhi;  Ning, Likui;  Tong, Jian
收藏  |  浏览/下载:11/0  |  提交时间:2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载:46/0  |  提交时间:2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载:42/0  |  提交时间:2021/02/02
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
作者:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
收藏  |  浏览/下载:7/0  |  提交时间:2021/02/02


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