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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng 收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02 Chip scale packages  Copper  Copper alloys  Flip chip devices  Grain boundaries  Growth rate  Size determination  Soldered joints  Substrates  Tin alloys, Electronic product  Grain boundary motions  Interface reactions  Lateral growth rates  Longitudinal growth  Packaging process  Packaging technologies  Solder composition, Soldering   Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887 作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao 收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02 Binary alloys  Copper alloys  Film thickness  Intermetallics  Lead-free solders  Molluscs  Ostwald ripening  Soldering  Tin alloys, Cooling rates  Furnace cooling  Grain diameter  Growth behavior  Growth behaviour  Layer thickness  Non-uniformities  Reflow temperatures, Cooling   Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文 ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265 作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Wu, Yingchao 收藏  |  浏览/下载：29/0  |  提交时间：2019/12/02 Electronic materials  Intermetallic compounds  Crystal growth  Thermogravimetric analysis  Diffusion  Finite element method   Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux 期刊论文 THIN SOLID FILMS, 2019, 卷号: 669, 页码: 198-207 作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Ma, Haitao;  Wang, Yunpeng 收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02 Solder  Intermetallic compounds film  Nanoparticles  Growth kinetics  Finite element method   Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints 期刊论文 METALS AND MATERIALS INTERNATIONAL, 2019, 卷号: 25, 页码: 499-507 作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Wang, Yanfeng;  Ma, Haitao 收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02 TiO2 nanoparticles  Intermetallic compounds  Ostwald ripening  von Mises stress  Solder  Interface   Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint 期刊论文 MICROELECTRONIC ENGINEERING, 2019, 卷号: 208, 页码: 47-53 作者:  Shang, Shengyan;  Wang, Yanfeng;  Wang, Yunpeng;  Ma, Haitao;  Kunwar, Anil 收藏  |  浏览/下载：121/0  |  提交时间：2019/12/02 Finite element analysis  Intermetallics  Hardness  Soldering  Scanning electron microscopy  Nanoparticles