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A comparison of heavy ion induced single event upset susceptibility in unhardened 6T/SRAM and hardened ADE/SRAM 会议论文
作者:  Yan, Weiwei;  Wang, Bin;  Zeng, Chuanbin;  Geng, Chao;  Liu, Tianqi
收藏  |  浏览/下载：40/0  |  提交时间：2018/08/20
Loss of N-Acetylglucosamine Phosphate Mutase Impair Protein Glycosylation, Plant Growth and Defense Response in Arabidopsis 会议论文
济州岛, 2017-08-27
作者:  贾晓晨,张洪艳,刘晓燕,秦洪强,叶明亮,尹恒;  Yin H(尹恒)
收藏  |  浏览/下载：21/0  |  提交时间：2017/10/29
Deep learning methods to guide CT image reconstruction and reduce metal artifacts 会议论文
作者:  Gjesteby, Lars;  Yang, Qingsong;  Xi, Yan;  Zhou, Ye;  Zhang, Junping
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
The Research of Household Asset Allocation Model Based on Life Cycle Theory 会议论文
PROCEEDINGS OF THE 9TH (2017) INTERNATIONAL CONFERENCE ON FINANCIAL RISK AND CORPORATE FINANCE MANAGEMENT, 2017-01-01
作者:  Liu Yan-wen;  Yang Ye-qing
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Development of the C-ADS SRF Accelerator at IHEP 会议论文
Lanzhou, China, 2017
作者:  H.Y. Zhu;  F.Yan;  L.Bian;  J.S.Cao;  Y.Chen
收藏  |  浏览/下载：73/0  |  提交时间：2018/03/14
Research on EBK Model and Its Application in Security Industry: An Empirical Research Based on S Security Company 会议论文
3RD INTERNATIONAL CONFERENCE ON SOCIAL SCIENCE AND MANAGEMENT (ICSSM 2017), 2017-01-01
作者:  
收藏  |  浏览/下载：9/0  |  提交时间：2019/04/24
Research on the Impacts of Time-Anticipatory Stress on Creativity 会议论文
3RD INTERNATIONAL CONFERENCE ON SOCIAL SCIENCE AND MANAGEMENT (ICSSM 2017), 2017-01-01
作者:  Wang, Yi-jing[1];  Qiao, Yu-meng[2];  Yu, Qin-ye[3];  Wang, Li-feng[4];  Zhao, Kang-yan[5]
收藏  |  浏览/下载：14/0  |  提交时间：2019/04/24
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24

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