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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2016     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Mfsd2a(+) hepatocytes repopulate the liver during injury and regeneration 期刊论文 2016, 卷号: 7, 期号: [db:dc_citation_issue] 作者:  Pu, Wenjuan[1,2];  Zhang, Hui[1,2];  Huang, Xiuzhen[1,2];  Tian, Xueying[1,2];  He, Lingjuan[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03 PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Ye, Hui[1];  Huang, Shirong[2];  Yuan, Zhichao[3];  Lu, Xiuzhen[4];  Jeppson, Kjell[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging 期刊论文 JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 卷号: 49 作者:  Bao, Jie[1];  Edwards, Michael[2];  Huang, Shirong[3];  Zhang, Yong[4];  Fu, Yifeng[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26 boron nitride  thermal conduction  lateral heat spreader  electrical insulation   Thermal properties of TIM using CNTs forest in electronics packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Zhang, Dongsheng[1];  Liu, Jiawen[2];  Sun, Shuangxi[3];  Huang, Shirong[4];  Bao, Jie[5] 收藏  |  浏览/下载：12/0  |  提交时间：2019/04/26 VACNT  heat  dissipation  hotspot  thermal test chip  resistance temperature detector   Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing 期刊论文 ELECTRONIC MATERIALS LETTERS, 2016, 卷号: 12, 页码: 1-16 作者:  Bao, Jie[1];  Jeppson, Kjell[2];  Edwards, Michael[3];  Fu, Yifeng[4];  Ye, Lilei[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26 two-dimensional hexagonal boron nitride  electronics manufacturing  van der waals heterostructures