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	Thermal properties of TIM using CNTs forest in electronics packaging
	Zhang, Dongsheng[1]; Liu, Jiawen[2]; Sun, Shuangxi[3]; Huang, Shirong[4]; Bao, Jie[5]; Wang, Ning[6]; Liu, Johan[7]; Lu, Xiuzhen[8]
	2016
会议名称	17th International Conference on Electronic Packaging Technology (ICEPT)
会议日期	2016-08-16
关键词	VACNT heat dissipation hotspot thermal test chip resistance temperature detector
页码	1355-1359
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2235055
专题	上海大学
作者单位	1.[1]Shanghai Univ, Sch Automat & Mech Engn, Inst Nanomicro Engergy, Sino Sweden Microsyst Integrat Technol Ctr, Shanghai, Peoples R China. 2.[2]Shanghai Univ, Sch Automat & Mech Engn, Inst Nanomicro Engergy, Sino Sweden Microsyst Integrat Technol Ctr, Shanghai, Peoples R China. 3.[3]Shanghai Univ, Sch Automat & Mech Engn, Inst Nanomicro Engergy, Sino Sweden Microsyst Integrat Technol Ctr, Shanghai, Peoples R China. 4.Chalmers, Elect Mat & Syst Lab, Dept Microtechnol & Nanosci MC2, Gothenburg, Sweden. 5.[4]Shanghai Univ, Sch Automat & Mech Engn, Inst Nanomicro Engergy, Sino Sweden Microsyst Integrat Technol Ctr, Shanghai, Peoples R China. 6.[5]Shanghai Univ, Sch Automat & Mech Engn, Inst Nanomicro Engergy, Sino Sweden Microsyst Integrat Technol Ctr, Shanghai, Peoples R China. 7.[6]Shanghai Univ, Sch Automat & Mech Engn, Inst Nanomicro Engergy, Sino Sweden Microsyst Integrat Technol Ctr, Shanghai, Peoples R China. 8.[7]Shanghai Univ, Sch Automat & Mech Engn, Inst Nanomicro Engergy, Sino Sweden Microsyst Integrat Technol Ctr, Shanghai, Peoples R China. 9.Chalmers, Elect Mat & Syst Lab, Dept Microtechnol & Nanosci MC2, Gothenburg, Sweden. 10.[8]Shanghai Univ, Sch Automat & Mech Engn, Inst Nanomicro Engergy, Sino Sweden Microsyst Integrat Technol Ctr, Shanghai, Peoples R China.
推荐引用方式 GB/T 7714	Zhang, Dongsheng[1],Liu, Jiawen[2],Sun, Shuangxi[3],et al. Thermal properties of TIM using CNTs forest in electronics packaging[C]. 见:17th International Conference on Electronic Packaging Technology (ICEPT). 2016-08-16.

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