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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple refl (CPCI-S收录) 会议 作者:  Zhou, Min-Bo[1];  Jin, Hong[1];  Ke, Chang-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 morphological evolution  intermetallic compounds  lead-free solder joint  multiple reflow  quasi in-situ method   Isothermal Aging Effect on Microstructure and Mechanical Properties of Ni/Sn3.0Ag0.5Cu/Ni Interconnects with the Decreasing Height (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Zeng, Jing-Bo[1];  Xu, Guang-Sui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Lead-free solder micro-interconnect  Intermetallic compound  Solder joint height  Tensile fracture behavior   The influence of electromigration and aging on the reliability of SnAgCu lead-free solder joint at 100°C (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Wei, Guoqiang[1];  Yao, Jian[1];  Shi, Yonghua[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Aging of materials  Electric currents  Electromigration  Electronics packaging  Fracture  Intermetallics  Lead compounds  Packaging  Scanning electron microscopy  Soldering alloys  Tensile strength  Tensile testing   The Influence of Electromigration and Aging on the Reliability of SnAgCu Lead-Free Solder Joint at 100 degrees C (CPCI-S收录) 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Wei, Guoqiang[1];  Yao, Jian[1];  Shi, Yonghua[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 electromigration  aging  interfacial IMC  tensile strength  fracture