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An Instance Segmentation Based Framework for Large-Sized High-Resolution Remote Sensing Images Registration 期刊论文
Remote Sensing, 2021, 卷号: 13, 期号: 9, 页码: 21
作者:  J. Y. Lu;  H. G. Jia;  T. Li;  Z. Q. Li;  J. Y. Ma and R. F. Zhu
收藏  |  浏览/下载：2/0  |  提交时间：2022/06/13
Design of swing type switching mechanism for focusing lens group in visible light television system with double focal lengths 期刊论文
Yi Qi Yi Biao Xue Bao/Chinese Journal of Scientific Instrument, 2018, 卷号: 39, 期号: 1, 页码: 84-91
作者:  Xu, Xinhang;  Zhang, Fei;  Xia, Wenbo
收藏  |  浏览/下载：9/0  |  提交时间：2019/09/17
Compensation for adjustment error in high positioning accuracy turntable measuring system 期刊论文
Jilin Daxue Xuebao (Gongxueban)/Journal of Jilin University (Engineering and Technology Edition), 2017, 卷号: 47, 期号: 3
作者:  Yan, Y.-Y.;  W. Liu and J.-J. Fu
收藏  |  浏览/下载：15/0  |  提交时间：2018/06/13
Dual-drive long-travel precise positioning stage of grating ruling engine 期刊论文
International Journal of Advanced Manufacturing Technology, 2017, 卷号: 93, 期号: 9
作者:  Wang, J. S.;  Bayanheshig and C. A. Zhu
收藏  |  浏览/下载：13/0  |  提交时间：2018/06/13
基于超精密定位的压电陶瓷驱动及其控制技术研究 学位论文
硕士: 中国科学院大学, 2015
作者:  江国栋
收藏  |  浏览/下载：63/0  |  提交时间：2016/04/11
Linearity calibration method of the high-precision displacement sensor 期刊论文
Yi Qi Yi Biao Xue Bao/Chinese Journal of Scientific Instrument, 2015, 卷号: 36, 期号: 5, 页码: 982-988
作者:  Zhang, D.;  C. Ge;  X. Li;  M. Ni;  K. Guo and P. Li
收藏  |  浏览/下载：18/0  |  提交时间：2016/08/24
高精度导星测量系统细分定位技术研究 学位论文
博士: 中国科学院大学, 2014
刘南南
收藏  |  浏览/下载：72/0  |  提交时间：2014/08/21
Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE) 会议论文
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
Cui J.; Zhao J.; Fan Z.; Zhao C.; Bi Y.; Zhang J.; Niu G.; Shi Z.; Pei B.; Zhang G.; Xue Y.; Qi Y.
收藏  |  浏览/下载：14/0  |  提交时间：2013/03/25
The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting  when the cutting velocity equals 100mm/min  while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth  double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow  rapid cutting speed  the cutting quality meets the expecting demand.  fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power  using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence  a /4 waveplate to compensate heat -induced birefraction  utilize the Nd:YAG self- aperture effect  more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens  double axis linear step motor positioning system  suitable beam expander multiplying factor  appropriate diameter of exit beam aperture  proper repetition rate  when the cutting velocity equals 400mm/min  0.75mm thick silicon wafer can be penetrated  

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