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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：北京航空航天大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析] 期刊论文 Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University, 2019, 卷号: 46, 页码: 54-60 作者:  Zhao, F.;  Qiu, Y.;  Jia, F.;  Ma, H. 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30 Ball grid arrays  Chip scale packages  Fatigue damage  Soldered joints  Stress analysis  Thermal cycling  Thermal stress  Vibration analysis  Coffin-Manson equation  Electronic Packaging  Fatigue lifetime  Incremental damage superposition approach  Plastic ball grid array packages  Temperature environments  Unified viscoplasticity  Vibration loading  Thermal fatigue   Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262 作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip-scale package (CSP)  flip-chip die attach  high-power light-emitting diode (LED)  reliability  voids   Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者:  Wang, Z.;  Fan, J.;  Liu, J.;  Hu, A.;  Qian, C. 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30 Chip scale packages  Light emission  Light emitting diodes  Phosphors  Silicones  Ultraviolet radiation  Viscosity  Cure process  Harsh environment  High temperature cure  Light emitting diode (LED)  Low-power consumption  Ultra-violet light  Ultraviolet light intensity  Ultraviolet-assisted  Curing   Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Wang, Zhen;  Fan, Jiajie;  Liu, Jie;  Hu, Aihua;  Qian, Cheng 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 LED  Chip scale package  Phosphor/silicone composites  Viscosity  Optimal cure process   Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015-12-02 作者:  Zeng, Q.;  Guan, Y.;  Su, F.;  Chen, J.;  Jin, Y. 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Finite element method  Reliability  Thermal cycling  Viscoelasticity  Chip deformations  Relaxation modulus  Silicon interposers  Temperature dependent  Thermal-mechanical reliability  Time dependent  Viscoelastic properties  Williams-Landel-Ferry equations  Three dimensional integrated circuits   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文 18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30 作者:  Liu, Huan;  Zeng, Qinghua;  Guan, Yong;  Fang, Runiu;  Sun, Xin 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Failure (mechanical)  Fatigue of materials  Finite element method  Shear stress  Soldering  Stresses  Thermal load  Timing circuits  Global simulation  Interfacial failures  Load condition  Maximum principal stress  Resistance measurement  Solder balls  Thermal mechanical stress  Thermal-mechanical reliability  Three dimensional integrated circuits