CORC

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CORC

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Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ren, Jing;  Huang, Mingliang;  Yang, Xudong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Characters of multicomponent lead-free solders 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 卷号: 24, 页码: 3925-3931
作者:  Zhao, N.;  Liu, X. Y.;  Huang, M. L.;  Ma, H. T.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11
Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-State Aging 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Liu, Ting;  Huang, Mingliang;  Zhao, Ning
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  Wang, J.;  Qu, L.;  An, L. L.;  Gu, L. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13
The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate 会议论文
2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, Guilin
作者:  Ma H.T.;  Wang J.;  Qu L.;  An L.L.;  Gu L.Y.
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/18
Leaching behavior of lead-free solders in a NaCl-Na2SO4-Na2Co3 mixed solution as simulated soil 期刊论文
Journal of the Chinese Society of Corrosion and Protection, 2011, 卷号: 31, 页码: 381-384+388
作者:  Wang L.;  Cheng C.;  Yang F.;  Zhao J.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/18
The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders 会议论文
7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, AUSTRALIA, 2010-08-02
作者:  Pan, Xuemin;  Zhao, Ning;  Ding, Ruifang;  Wei, Guanglin;  Wang, Lai
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24
The correlation between the liquid structure and the viscosity of Sn-Cu lead-free solders 会议论文
International Conference on Manufacturing Science and Engineering (ICMSE 2009), Zhuhai, PEOPLES R CHINA, 2009-12-26
作者:  Pan, Xuemin;  Zhao, Ning;  Ding, Ruifang;  Wei, Guanglin;  Wang, Lai
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24
The correlation between the liquid structure and the viscosity of Sn-Cu lead-free solders 期刊论文
Advanced Materials Research, 2010, 卷号: 97, 页码: 679-682
作者:  Pan XM(潘学民)
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24

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